A ceramic bowl that proves tradition can still outsmart modern “smart” design.
I ran across this video a few days ago and couldn’t stop watching it.
It’s about something ordinary & boring, a plastic gas lighter. But it changes how one thinks about manufacturing.
That lighter in so many of our homes, holds pressurised gas. It has over 30 microscopic parts, has to pass international safety codes, & travel 10,000 miles by sea, & the total cost of doing all that, materials, labour, freight, every middleman along the way, comes to fifteen U.S cents.
So how does anyone make money on this?
Turns out almost the entire world’s supply comes from one place: a county called Shaodong, in China’s Hunan province.
It wasn’t always there.
But today, Shaodong has 114 lighter-related companies packed into the place & between them they source more than 200 different components from each other, all within a 20-kilometre radius. They supply something like seventy percent of the world’s disposable lighters. And the industry alone employs over 80,000 people locally.
Nobody there is winning on cheap labour anymore. They’re winning by shaving a thousandth of a cent off the thickness of a plastic wall, or redesigning a base so a few thousand more units fit into the same shipping container.
It took my thoughts back to an old professor of mine, Michael Porter.
His 1980 book, Competitive Strategy, is still the 1st book most MBAs read, the one that gave the world the Five Forces and basically invented modern strategic thinking.
But there’s a quieter piece of his work, on industrial clusters, that never got nearly the same attention, and it is the one that explains exactly what is happening in Shaodong.
His argument was that nations and regions rarely win because of cheap inputs. They win when rival firms and specialist suppliers crowd into the same small geography for long enough that they keep pushing each other past what any one of them could manage alone. He found it in the Swiss watchmaking towns of the Jura, in the German printing press industry and in Italy’s ceramic tile and footwear districts (interestingly, it’s the SAME blueprint which built Morbi, in Gujarat, into the world’s second-largest ceramic cluster, now outproducing Italy by volume. I have posted before, about Morbi)
None of these started out as giants. The neighbourhood made them giants.
Which is exactly why it’s so relevant to India’s climb up the global manufacturing table
I’ve also attached a slide with this post that I saw recently and which shows us breaking into the top 5 manufacturing globally. (A quick reference check told me that we may not have overtaken Korea yet, but the trajectory’s clear)
That climb has happened on the back of scale: bigger plants, bigger parks, more FDI.
I should declare an interest here, because the Mahindra Group set up 2 of India’s first integrated, plug-and-play business cities, in Chennai in 2002 & Jaipur in 2006.
Both have been extremely successful. Chennai’s business zone alone today employs 45,000 people..
But I admit that we need to think differently.
A park brings in investors and hands them a ready plot, power, water & roads
A cluster is a completely different animal: hundreds of small, specialised suppliers, each obsessed with doing a tiny thing better than anyone else, feeding off each other’s presence for years until no outsider can compete with the whole.
I think that’s the work ahead of us now.
Not just more factories, and not just more parks.
Policymakers & developers like us need to start consciously pulling as many of the inputs and resources a sector needs, the toolmakers, the component suppliers, the testing labs, the logistics specialists, into the same neighbourhood.
Shaodong and Morbi both got there by accident, one town stumbling onto a way to shave a thousandth of a cent off a lighter wall, the other discovering it had the clay and, later, the gas pipeline for tiles.
We don’t have the luxury of waiting for accidents anymore.
We need to do it on purpose
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Intel’s EMIB Packaging Is Growing Rapidly — Silicon Capacitors Are Taking Off Too
Silicon capacitors are poised for explosive growth in the AI semiconductor space. Intel has been found to be planning a large-scale adoption of silicon capacitors starting next year, in order to enhance the performance of its in-house 2.5D packaging technology, “EMIB.”
The most clearly visible source of demand is Google. Google plans to launch its next-generation AI accelerator, “v8e,” in the second half of next year, and has adopted an EMIB substrate with embedded silicon capacitors for that chip. With other Big Tech companies such as Amazon also currently applying EMIB, analysts say demand could increase sharply.
According to industry sources on the 27th, Intel plans to apply silicon capacitors to its 2.5D packaging starting next year.
Intel Adopts “Silicon Capacitors” for 2.5D Packaging… Google AI Chip Gets First Application
2.5D is an advanced packaging technology that inserts a thin-film interposer between the semiconductor and the substrate. Because it can connect circuits at higher density compared with conventional packaging that uses only a substrate, demand is rising in the AI and HPC fields.
To improve cost efficiency in 2.5D packaging, Intel devised its own technology called EMIB. Rather than using a broad, spread-out interposer, EMIB connects chip to chip using a small silicon bridge. Since bridges only need to be placed where chip-to-chip connections are required, chips can be arranged more flexibly and efficiently.
Recently, EMIB has been drawing attention as an alternative to TSMC, which had been leading the existing 2.5D packaging market. This is because TSMC’s 2.5D packaging capacity is suffering from a supply shortage amid the rapid development of the AI industry.
Indeed, global Big Tech player Google is also paying attention to EMIB. Google has decided to adopt EMIB for its in-house AI semiconductor “v8e,” which it plans to launch in the second half of next year. Under this structure, TSMC handles chip mass production, MediaTek handles design and manufacturing support, and Intel handles packaging.
However, there have been concerns that EMIB is gradually showing limitations in providing stable power supply for AI semiconductors, which consume large amounts of power. Accordingly, Intel plans to introduce new technologies such as silicon capacitors and through-silicon vias (TSV) to ensure stable packaging for the v8e.
A capacitor is a component that stores and releases electricity in an electronic circuit. In the case of silicon capacitors, their resistance (ESL/ESR) is more than 100 times lower than that of conventional multilayer ceramic capacitors (MLCC), minimizing the signal loss that occurs in high-performance semiconductors. They can also be designed in an ultra-thin structure based on a silicon wafer, enabling high-density integration.
A semiconductor industry official explained, “Because the voltage drop (the phenomenon of voltage decreasing) that occurs in the high-frequency region within AI chips is difficult to solve with MLCC, we understand that Intel is adopting silicon capacitors as a solution,” adding, “The relevant supply chain is now in place, and mass production is set to begin in earnest next year.”
EMIB-T Is Already on a Growth Trajectory — The Related Ecosystem and Market Are Expanding Together
Intel has also inserted TSVs, which serve as power-delivery channels, into the silicon bridge. The key point is that by using TSVs to shorten the power-delivery path between the substrate and the chip, Intel has improved power efficiency and signal integrity. Intel calls this “EMIB-T.”
The industry expects the EMIB-T and silicon capacitor markets to grow rapidly.
This is because Japan’s Ibiden — one of the major companies that mass-produces semiconductor substrates for EMIB-T — is aggressively pursuing capital investment.
Previously, Ibiden had planned to build its Kawashima (Gama) plant in Gifu Prefecture as a substrate plant for Intel CPUs. However, it postponed that schedule and decided in the first half of this year to officially convert the Gama plant into a mass-production line for EMIB-T substrates. The investment is 220 billion yen (about KRW 2.1 trillion).
In its recent earnings announcement, Ibiden stated, “Operation of the Gama plant will begin in 2027 and enter full-scale mass production in 2028,” adding, “EMIB-T substrate capacity is currently far short of demand. However, adding further capacity is quite difficult, so we are discussing options with our customers.”
A semiconductor industry official explained, “Ibiden’s EMIB-T-dedicated line is being built with most of the investment coming from customers such as Google, Amazon, and Intel,” adding, “This demonstrates that AI semiconductors based on EMIB-T will grow significantly going forward, and silicon capacitors are likely to expand alongside them.”
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⚡ Power Unleashed: Welcome to Alchemax Headquarters!
Step into the heart of corporate ambition and temporal chaos. Once the epicenter of Miguel O'Hara's groundbreaking genetic research, Alchemax HQ now stands as a high-stakes battlefield where the past, present, and future collide. From the sterile, high-tech intensity of the Main Gene Lab to the serene, deceptive beauty of the Babylon Garden, this corporate containment site for the raw, pulsing energy of Cyclops' optic blasts has been brought to the present by Moon Girl.
Whether you're maneuvering through the sleek, nano-ceramic halls or taking in the view from the Infinity-Edge Pool overlooking the Manhattan skyline, remember: you're not just fighting for territory, you're fighting within the epicenter of a timeline-shattering rescue mission.
Available from May 28th, 2026 UTC!
The time has come to save the heroes and stop the sins of Alchemax!
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No one has ever developed a fully reusable orbital heat shield
When you return from orbital velocity, you come in like a flaming meteor. You are a raging ball of fire. It is incredibly difficult to build a heat shield that doesn’t melt, shatter, or get destroyed in the process
SpaceX is changing that. They have developed the most advanced ceramic heat tiles in history. Unlike the Space Shuttle, which required months of meticulous inspections and tile replacements after every flight, Starship's heat shield is built for rapid, reliable reuse
This is the holy grail of engineering
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