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AI 编程平台 Replit 宣布获得 Visa 投资并达成战略合作。双方将探索把 Visa Intelligent Commerce 集成至 Replit 平台，使开发者能够在构建 AI Agent 和应用时直接接入支付能力。Visa 透露，目前已有超过 1000 名员工使用 Replit 进行内部原型开发与软件创建。

最近市场给我的感觉很明显：单纯讲故事的项目越来越难打动人了，大家要看的不是 PPT，而是 真实用户、真实场景、真实需求。 @sleepagotchi 所以我最近重新看 @sleepagotchi，反而越看越有意思。 以前我对它的印象是 Sleep-to-Earn，睡觉、打卡、养成、奖励，听起来很轻。但这次它不是简单换个叙事，而是把自己升级成 Wellness Economy 的 Intelligence Layer。这个方向我觉得挺关键：现在 AI、可穿戴设备、健康数据都在爆发，但大多数产品只是给你一个分数、一张图，然后就没了。Sleepagotchi 想做的是把睡眠、恢复、饮食、压力、运动这些碎片化信号，用 AI Agent 串起来，变成真正能指导行动的个人健康智能层。 更重要的是，它不是空转概念。官方提到 Telegram Lite 已经有 200 万用户，起床后 10 分钟内打开率 78%，三周 beta 收入超过 10 万美元。这说明用户不是被“空投幻想”拉来的，而是真的愿意每天回来。 现在 Sleep Coach 已经上线，还接入 WHOOP、Oura、Apple Watch 这类可穿戴数据。后面还会有 Wellness Coach、Meal Planner、Shopping Agent。$SLEEP 的价值也不只是“发奖励”，而是围绕 AI credits、订阅权益、质押等级、挑战、marketplace、合作伙伴活动去形成循环。 说实话，在现在这个行情里，我更愿意关注这种有消费场景、有用户粘性、又能吃到 AI 和健康数据红利的项目。 睡觉本来是每天都要做的事，如果一个项目能把“好好睡觉”变成链上的身份、数据价值和奖励系统，那它就不是简单 GameFi，而是在把一个日常习惯做成新的入口。 我不想错过这种早期信号。 @Sleepagotchi 这一章，才刚刚醒来。

A few projects made some serious moves behind the scenes: @XOOBNetwork continues rewarding real users, distributing Nomisen IDs to top campaign contributors, Nomisma participants, and Genesis NFT holders. always good to see ecosystems rewarding consistency instead of pure hype. @useTria keeps proving that consumer crypto is no longer just theory: • $100M+ card spend • $200M+ routed via BestPath • nearly $1B futures volume • $40M+ AUM • $5M+ distributed back to users they’re building a system where crypto actually feels usable in daily life spend, swap, trade, travel, all connected. travel feature drops in 2 weeks 👀 @sleepagotchi is evolving far beyond “sleep-to-earn.” Now positioning itself as an AI-powered wellness intelligence layer with wearable integrations (WHOOP, Oura, Apple Watch), personalized coaching, and user-owned health data tied into $SLEEP utility. definitely one of the more ambitious pivots in the health x AI space. @quipnetwork still cooking quietly in the quantum sector: post-quantum security, decentralized hybrid compute, and real quantum randomness infrastructure. while most people wait for the future, they’re already building for it. @TheARCTERMINAL dropped an important reminder: privacy isn’t “trust us, we won’t look.” real privacy means the architecture itself makes it impossible for servers to read your data. AI sovereignty will matter more and more from here. and shoutout to @River4fun too 🌊 still one of the more underrated communities grinding consistently, building engagement organically, and keeping the timeline alive while others disappear after the hype cycle. bear market or not… builders still building. real users still active. that’s what matters.

机器人世界模型（全新维度，0 去重 = 全新信息） 核心项目： - Awesome-WAM（OpenMOSS）：World Action Models 综合论文列表，含 DreamDojo（从人类视频学习的通用机器人世界模型） - awesome-physical-ai：VLA 模型、世界模型、具身基础模型论文合集，含 NVIDIA Cosmos Predict2.5 - π₀/π₀.5（Physical Intelligence）：视觉-语言-动作流模型，通用机器人控制 - GR00T N1（NVIDIA）：通用人形机器人开放基础模型 - InternVLA-A1（阿里巴巴）：统一理解、生成和动作的机器人操作模型 仿真环境： Genesis、Isaac Sim、MuJoCo 仍是主流 操作策略： LeRobot（Hugging Face）、Octo、Diffusion Policy、ACT 是当前热门

三、新颖AI应用/SaaS（中国尚未广泛讨论） 1. WorkBuddy — 中国AI Agent出海成功案例 - 已成为中国最广泛使用的生产力AI Agent之一 - 在小红书上用户分享：分钟级生成个人网站、自动化周报、PPT制作 - 现已全球化扩展 - 🔗 2. SeniorCRE AI-Native Workforce Intelligence（5月28日发布） - 面向老年护理行业的AI劳动力优化平台 - 可减少40%+的机构劳动力支出 - 改善临床稳定性和居民结果 - 🔗 3. Luma Agents — 多AI系统创意工作流 - 基于Luma Uni-1模型 - 协调多个AI系统完成端到端创意工作（文本、图像、视频、音频） - CEO描述为构建创意简报的"内部心理表征" - 🔗 4. Microsoft Agent Governance Toolkit（4月发布） - 自主AI代理的完整治理层 - 7个包、多语言支持 - 集成LangChain、OpenAI Agents、Haystack、Azure - 映射到EU AI Act、HIPAA、SOC2要求 - 免费开源在GitHub和PyPI - 🔗 5. StitcherAI — IT财务智能平台 - 从隐身模式推出，获$300万前种子轮融资 - 统一AI、云、SaaS和内部IT成本数据 - 嵌入式IT财务情报系统 - 🔗 6. Google智能眼镜（Android XR） - 与三星、Qualcomm合作 - 与Warby Parker、Gentle Monster设计联名款 - 将Gemini集成到日常穿戴设备 - 🔗 7. OpenAI推理模型证明数学猜想（5月20日） - OpenAI内部推理模型证明了Erdős 1946年提出的平面单位距离猜想 - 已通过外部数学家验证 - 🔗

From AI tools to AI workflows. Roam is building the next user-friendly AI economy, where intelligence is not just accessed, but actually put to work. Join us on 28th. May 2026 at 7:30 PM PST ( 10:30 AM UTC+8 )as we explore what comes next with our guest: @AstarterDefiHub @TheAliceAI @talk99 @LuffaApp @NoosProtocol 📷Join Here:

Elon Musk: "There are really only three hard things for humanoid robots: the real-world intelligence, the hand, and scale manufacturing. And I haven't seen any even demo robots that have a great hand, But Optimus does have that. We had to design custom actuators, basically custom-designed motors, gears, power electronics, controls, sensors—everything had to be designed from physics first principles. There is no supply chain for this.”

Intel’s EMIB Packaging Is Growing Rapidly — Silicon Capacitors Are Taking Off Too Silicon capacitors are poised for explosive growth in the AI semiconductor space. Intel has been found to be planning a large-scale adoption of silicon capacitors starting next year, in order to enhance the performance of its in-house 2.5D packaging technology, “EMIB.” The most clearly visible source of demand is Google. Google plans to launch its next-generation AI accelerator, “v8e,” in the second half of next year, and has adopted an EMIB substrate with embedded silicon capacitors for that chip. With other Big Tech companies such as Amazon also currently applying EMIB, analysts say demand could increase sharply. According to industry sources on the 27th, Intel plans to apply silicon capacitors to its 2.5D packaging starting next year. Intel Adopts “Silicon Capacitors” for 2.5D Packaging… Google AI Chip Gets First Application 2.5D is an advanced packaging technology that inserts a thin-film interposer between the semiconductor and the substrate. Because it can connect circuits at higher density compared with conventional packaging that uses only a substrate, demand is rising in the AI and HPC fields. To improve cost efficiency in 2.5D packaging, Intel devised its own technology called EMIB. Rather than using a broad, spread-out interposer, EMIB connects chip to chip using a small silicon bridge. Since bridges only need to be placed where chip-to-chip connections are required, chips can be arranged more flexibly and efficiently. Recently, EMIB has been drawing attention as an alternative to TSMC, which had been leading the existing 2.5D packaging market. This is because TSMC’s 2.5D packaging capacity is suffering from a supply shortage amid the rapid development of the AI industry. Indeed, global Big Tech player Google is also paying attention to EMIB. Google has decided to adopt EMIB for its in-house AI semiconductor “v8e,” which it plans to launch in the second half of next year. Under this structure, TSMC handles chip mass production, MediaTek handles design and manufacturing support, and Intel handles packaging. However, there have been concerns that EMIB is gradually showing limitations in providing stable power supply for AI semiconductors, which consume large amounts of power. Accordingly, Intel plans to introduce new technologies such as silicon capacitors and through-silicon vias (TSV) to ensure stable packaging for the v8e. A capacitor is a component that stores and releases electricity in an electronic circuit. In the case of silicon capacitors, their resistance (ESL/ESR) is more than 100 times lower than that of conventional multilayer ceramic capacitors (MLCC), minimizing the signal loss that occurs in high-performance semiconductors. They can also be designed in an ultra-thin structure based on a silicon wafer, enabling high-density integration. A semiconductor industry official explained, “Because the voltage drop (the phenomenon of voltage decreasing) that occurs in the high-frequency region within AI chips is difficult to solve with MLCC, we understand that Intel is adopting silicon capacitors as a solution,” adding, “The relevant supply chain is now in place, and mass production is set to begin in earnest next year.” EMIB-T Is Already on a Growth Trajectory — The Related Ecosystem and Market Are Expanding Together Intel has also inserted TSVs, which serve as power-delivery channels, into the silicon bridge. The key point is that by using TSVs to shorten the power-delivery path between the substrate and the chip, Intel has improved power efficiency and signal integrity. Intel calls this “EMIB-T.” The industry expects the EMIB-T and silicon capacitor markets to grow rapidly. This is because Japan’s Ibiden — one of the major companies that mass-produces semiconductor substrates for EMIB-T — is aggressively pursuing capital investment. Previously, Ibiden had planned to build its Kawashima (Gama) plant in Gifu Prefecture as a substrate plant for Intel CPUs. However, it postponed that schedule and decided in the first half of this year to officially convert the Gama plant into a mass-production line for EMIB-T substrates. The investment is 220 billion yen (about KRW 2.1 trillion). In its recent earnings announcement, Ibiden stated, “Operation of the Gama plant will begin in 2027 and enter full-scale mass production in 2028,” adding, “EMIB-T substrate capacity is currently far short of demand. However, adding further capacity is quite difficult, so we are discussing options with our customers.” A semiconductor industry official explained, “Ibiden’s EMIB-T-dedicated line is being built with most of the investment coming from customers such as Google, Amazon, and Intel,” adding, “This demonstrates that AI semiconductors based on EMIB-T will grow significantly going forward, and silicon capacitors are likely to expand alongside them.”