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Intel’s EMIB Packaging Is Growing Rapidly — Silicon Capacitors Are Taking Off Too Silicon capacitors are poised for explosive growth in the AI semiconductor space. Intel has been found to be planning a large-scale adoption of silicon capacitors starting next year, in order to enhance the performance of its in-house 2.5D packaging technology, “EMIB.” The most clearly visible source of demand is Google. Google plans to launch its next-generation AI accelerator, “v8e,” in the second half of next year, and has adopted an EMIB substrate with embedded silicon capacitors for that chip. With other Big Tech companies such as Amazon also currently applying EMIB, analysts say demand could increase sharply. According to industry sources on the 27th, Intel plans to apply silicon capacitors to its 2.5D packaging starting next year. Intel Adopts “Silicon Capacitors” for 2.5D Packaging… Google AI Chip Gets First Application 2.5D is an advanced packaging technology that inserts a thin-film interposer between the semiconductor and the substrate. Because it can connect circuits at higher density compared with conventional packaging that uses only a substrate, demand is rising in the AI and HPC fields. To improve cost efficiency in 2.5D packaging, Intel devised its own technology called EMIB. Rather than using a broad, spread-out interposer, EMIB connects chip to chip using a small silicon bridge. Since bridges only need to be placed where chip-to-chip connections are required, chips can be arranged more flexibly and efficiently. Recently, EMIB has been drawing attention as an alternative to TSMC, which had been leading the existing 2.5D packaging market. This is because TSMC’s 2.5D packaging capacity is suffering from a supply shortage amid the rapid development of the AI industry. Indeed, global Big Tech player Google is also paying attention to EMIB. Google has decided to adopt EMIB for its in-house AI semiconductor “v8e,” which it plans to launch in the second half of next year. Under this structure, TSMC handles chip mass production, MediaTek handles design and manufacturing support, and Intel handles packaging. However, there have been concerns that EMIB is gradually showing limitations in providing stable power supply for AI semiconductors, which consume large amounts of power. Accordingly, Intel plans to introduce new technologies such as silicon capacitors and through-silicon vias (TSV) to ensure stable packaging for the v8e. A capacitor is a component that stores and releases electricity in an electronic circuit. In the case of silicon capacitors, their resistance (ESL/ESR) is more than 100 times lower than that of conventional multilayer ceramic capacitors (MLCC), minimizing the signal loss that occurs in high-performance semiconductors. They can also be designed in an ultra-thin structure based on a silicon wafer, enabling high-density integration. A semiconductor industry official explained, “Because the voltage drop (the phenomenon of voltage decreasing) that occurs in the high-frequency region within AI chips is difficult to solve with MLCC, we understand that Intel is adopting silicon capacitors as a solution,” adding, “The relevant supply chain is now in place, and mass production is set to begin in earnest next year.” EMIB-T Is Already on a Growth Trajectory — The Related Ecosystem and Market Are Expanding Together Intel has also inserted TSVs, which serve as power-delivery channels, into the silicon bridge. The key point is that by using TSVs to shorten the power-delivery path between the substrate and the chip, Intel has improved power efficiency and signal integrity. Intel calls this “EMIB-T.” The industry expects the EMIB-T and silicon capacitor markets to grow rapidly. This is because Japan’s Ibiden — one of the major companies that mass-produces semiconductor substrates for EMIB-T — is aggressively pursuing capital investment. Previously, Ibiden had planned to build its Kawashima (Gama) plant in Gifu Prefecture as a substrate plant for Intel CPUs. However, it postponed that schedule and decided in the first half of this year to officially convert the Gama plant into a mass-production line for EMIB-T substrates. The investment is 220 billion yen (about KRW 2.1 trillion). In its recent earnings announcement, Ibiden stated, “Operation of the Gama plant will begin in 2027 and enter full-scale mass production in 2028,” adding, “EMIB-T substrate capacity is currently far short of demand. However, adding further capacity is quite difficult, so we are discussing options with our customers.” A semiconductor industry official explained, “Ibiden’s EMIB-T-dedicated line is being built with most of the investment coming from customers such as Google, Amazon, and Intel,” adding, “This demonstrates that AI semiconductors based on EMIB-T will grow significantly going forward, and silicon capacitors are likely to expand alongside them.”

succubus to post abt my strawpage that I made for drawing ideas !! >w< Will be tagged on my page as well so feel free 2 send stuffffs #nsfw# #nsfwart# #nsfwtwtًً# 🔞

Samsung Electronics is expected to award 78,000 semiconductor workers as much as Won600mn each after reaching a landmark profit-sharing deal, drawing criticism from conservatives who fear it could encourage similar demands at other South Korean companies.

US Homeland Security Secretary Markwayne Mullin said the Trump administration is drawing up plans to stop processing international travelers ‌and cargo at major US airports in ‘sanctuary cities’ that have declined to cooperate with an immigration crackdown

Zhongshan is hitting a major home run for Chinese sports infrastructure! The brand-new Zhongshan International Baseball and Softball Center has officially emerged as a pioneer, utilizing an innovative public-private partnership model to accelerate the growth of a world-class sports complex. The venue is already gearing up for the global spotlight, locked in to host the prestigious 2027 WBSC Premier12 Qualifier this coming November 2026. Beyond drawing elite international tournaments and serving as a recreational hub for Japanese, South Korean, and local residents alike, the center is a core training ground for student athletes—fueling the city's grand vision to make baseball China's next signature.

Sometimes I wonder… even after putting all my effort into drawing and making the best poses possible, the algorithm still doesn’t seem to be on my side :( Do you guys experience this too? (┬﹏┬) Tell me in the comment bellow #artmoots# #ArtistOnTwitter#

Zhongshan is hitting a major home run for Chinese sports infrastructure! The brand-new Zhongshan International Baseball and Softball Center has officially emerged as a pioneer, utilizing an innovative public-private partnership model to accelerate the growth of a world-class sports complex. The venue is already gearing up for the global spotlight, locked in to host the prestigious 2027 WBSC Premier12 Qualifier this coming November 2026. Beyond drawing elite international tournaments and serving as a recreational hub for Japanese, South Korean, and local residents alike, the center is a core training ground for student athletes—fueling the city's grand vision to make baseball China's next signature sport!

Chinese foreign direct investment in #Europe#, including the United Kingdom, climbed 67 percent year-on-year to 16.8 billion euros ($19.6 billion), the highest level since 2018, according to a recent study by Rhodium Group and other industry trackers. The automotive sector remained the dominant investment destination, drawing 7.6 billion euros, with 93 percent tied to electric vehicle supply chains. #trade#