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Elon Musk emphasizes that the complexity of developing a reusable orbital rocket is incredibly high. That's why "many smart people have tried it before, and no one has succeeded… most have kinda just been given up halfway through." “We live on a planet where the gravity is actually very strong... That means that you have to have ‘A pluses’ across the board, incredibly efficient engines, incredibly efficient structure, you do need scale, that’s why Starship is so gigantic... But if full and rapid reusability can be achieved, it reduces the cost of access to orbit by a factor of 100 or more... The difference between humanity being a multiplanet species or a single-planet species… It’s really that big of a deal.” Video: @SpaceX

Intel’s EMIB Packaging Is Growing Rapidly — Silicon Capacitors Are Taking Off Too Silicon capacitors are poised for explosive growth in the AI semiconductor space. Intel has been found to be planning a large-scale adoption of silicon capacitors starting next year, in order to enhance the performance of its in-house 2.5D packaging technology, “EMIB.” The most clearly visible source of demand is Google. Google plans to launch its next-generation AI accelerator, “v8e,” in the second half of next year, and has adopted an EMIB substrate with embedded silicon capacitors for that chip. With other Big Tech companies such as Amazon also currently applying EMIB, analysts say demand could increase sharply. According to industry sources on the 27th, Intel plans to apply silicon capacitors to its 2.5D packaging starting next year. Intel Adopts “Silicon Capacitors” for 2.5D Packaging… Google AI Chip Gets First Application 2.5D is an advanced packaging technology that inserts a thin-film interposer between the semiconductor and the substrate. Because it can connect circuits at higher density compared with conventional packaging that uses only a substrate, demand is rising in the AI and HPC fields. To improve cost efficiency in 2.5D packaging, Intel devised its own technology called EMIB. Rather than using a broad, spread-out interposer, EMIB connects chip to chip using a small silicon bridge. Since bridges only need to be placed where chip-to-chip connections are required, chips can be arranged more flexibly and efficiently. Recently, EMIB has been drawing attention as an alternative to TSMC, which had been leading the existing 2.5D packaging market. This is because TSMC’s 2.5D packaging capacity is suffering from a supply shortage amid the rapid development of the AI industry. Indeed, global Big Tech player Google is also paying attention to EMIB. Google has decided to adopt EMIB for its in-house AI semiconductor “v8e,” which it plans to launch in the second half of next year. Under this structure, TSMC handles chip mass production, MediaTek handles design and manufacturing support, and Intel handles packaging. However, there have been concerns that EMIB is gradually showing limitations in providing stable power supply for AI semiconductors, which consume large amounts of power. Accordingly, Intel plans to introduce new technologies such as silicon capacitors and through-silicon vias (TSV) to ensure stable packaging for the v8e. A capacitor is a component that stores and releases electricity in an electronic circuit. In the case of silicon capacitors, their resistance (ESL/ESR) is more than 100 times lower than that of conventional multilayer ceramic capacitors (MLCC), minimizing the signal loss that occurs in high-performance semiconductors. They can also be designed in an ultra-thin structure based on a silicon wafer, enabling high-density integration. A semiconductor industry official explained, “Because the voltage drop (the phenomenon of voltage decreasing) that occurs in the high-frequency region within AI chips is difficult to solve with MLCC, we understand that Intel is adopting silicon capacitors as a solution,” adding, “The relevant supply chain is now in place, and mass production is set to begin in earnest next year.” EMIB-T Is Already on a Growth Trajectory — The Related Ecosystem and Market Are Expanding Together Intel has also inserted TSVs, which serve as power-delivery channels, into the silicon bridge. The key point is that by using TSVs to shorten the power-delivery path between the substrate and the chip, Intel has improved power efficiency and signal integrity. Intel calls this “EMIB-T.” The industry expects the EMIB-T and silicon capacitor markets to grow rapidly. This is because Japan’s Ibiden — one of the major companies that mass-produces semiconductor substrates for EMIB-T — is aggressively pursuing capital investment. Previously, Ibiden had planned to build its Kawashima (Gama) plant in Gifu Prefecture as a substrate plant for Intel CPUs. However, it postponed that schedule and decided in the first half of this year to officially convert the Gama plant into a mass-production line for EMIB-T substrates. The investment is 220 billion yen (about KRW 2.1 trillion). In its recent earnings announcement, Ibiden stated, “Operation of the Gama plant will begin in 2027 and enter full-scale mass production in 2028,” adding, “EMIB-T substrate capacity is currently far short of demand. However, adding further capacity is quite difficult, so we are discussing options with our customers.” A semiconductor industry official explained, “Ibiden’s EMIB-T-dedicated line is being built with most of the investment coming from customers such as Google, Amazon, and Intel,” adding, “This demonstrates that AI semiconductors based on EMIB-T will grow significantly going forward, and silicon capacitors are likely to expand alongside them.”

BREAKING: Cumulative crypto card payment volumes have reached a record $7.8 billion, with monthly volumes now up +230% since May 2025. Crypto card adoption has rapidly accelerated in 2026 due to growing access to stablecoins as a payment rail through crypto cards. In other words, more people can now spend stablecoins like fiat by using crypto cards, further driving adoption. The growth comes amid the launch of Jupiter Global, which has seen a +648% surge in spending volume over the last 2 months. Visa is capturing ~90% of onchain card transactions via crypto-native infrastructure partnerships like Jupiter Global. Crypto cards are the ultimate use case for stablecoins.

Xinhua: "Profits of China's major industrial firms increased 18.2% year on year during the January-April period, surpassing a rise of 15.5% in the first quarter." Total profits are low but rising rapidly, balancing the lagging growth in wages.

BYD for years used billions owed to suppliers as cheap financing to fund its rapid growth from a little-known component maker to a powerhouse reshaping the world’s auto industry. Now, Beijing is forcing it to clean up its books:

NASA has just launched a new website for its Moon Base missions, which aims to build a permanent $20 billion U.S. base on the Moon. @SpaceX's Starship rocket will play a big role in these missions. "The Moon Base is a home away from Earth for Artemis astronauts who will live and work at humanity’s first lunar outpost. NASA is leading global teams of innovators across international space agencies, industry, and academia to build the Moon Base and establish an enduring human presence near the lunar South Pole for the benefit of all. Phase One (Now–2029): Experiment and Learn NASA will begin with a rapid series of robotic missions to scout the lunar South Pole region, test technologies, and prepare for surface operations ahead of future astronaut missions.: • A major increase in lunar activity, with up to 25 missions, including 21 landings. • Crewed and autonomous rovers for mobility demonstrations and surface preparation, along with four drones known as MoonFall and communications relay and observation satellites. • Early demonstrations of power, navigation, communications, and nuclear radioisotope heater unit technologies designed to endure the long lunar night. • Scientific payload opportunities integrated across landers and rovers. • The first tangible footprint of Moon Base effort, with four tons of payload delivered to test what works on the lunar surface. Phase Two (2029–2032): Early Habitation By 2029, NASA will transition to assembling semi-permanent infrastructure and initiating early habitation and logistics operations: • Deployment of expanded solar power systems and initial nuclear surface power capabilities, potentially including fission reactors and radioisotope power systems. • Upgraded rovers, potential advanced MoonFall drones, and early habitation elements. • Enhanced surface-to-orbit communications networks to provide reliable connectivity across the lunar South Pole region. • Delivery of up to 60 tons of cargo through as many as 24 landings using low-, medium-, and heavy-class cargo landers. Phase Three (2032 and Beyond): Sustained Human Presence This phase will scale operations to achieve a true enduring presence, with routine crew rotations and continuous surface activity. This is when living and working on the Moon becomes a reality: • Semi-permanent habitation modules with spacious interior for crew living and operations. • Operational fission surface power systems capable of delivering steady, reliable energy through the long lunar nights, leveraging in situ resource manufacturing. • Advanced logistics networks supported by crewed and autonomous rovers to keep the base supplied and functioning year-round. • Delivery of up to 38 tons of cargo annually to sustain habitats, power systems, logistics operations, and major science outposts, enabled by low-cost reusable heavy-lift capabilities." Moon base website:

🚨🇨🇳 China’s yuan is rapidly eating into dollar dominance Goldman Sachs says RMB use in China-linked trade surged from 13% in 2019 to 30% last year, while cross-border yuan transactions exploded from 9 trillion yuan in 2017 to 64 trillion in 2024. Beijing sees the yuan's internationalization as strategic insurance — and the trend is only accelerating.

Today we’re announcing our $113M Series B led by @CapitalGVC. Over the last 6 months, weekly volume on OpenRouter grew from 5T to 25T tokens as AI rapidly shifts from experimentation into production. We’re excited for what comes next.