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Major Project Updates: 🔹Hyperliquid launches canonical outcome markets with validators as the source of truth, removing third-party oracle dependencies. 🔹Berachain introduces PoL Next to streamline tokenomics and minimize inflation. 🔹Base rolls out Base MCP, enabling AI agents to swap, trade, and connect to leading Base apps. 🔹Pump expands to USDC pairs and multichain trading across Ethereum, Base, BNB, and more. 4/6

10小时稳稳翻倍！ENA空单 现货仅跌5.6%，20X杠杆直接干到110.07%收益 多空八杀全拿捏，策略上线4年+无杠杆累计收益1586.49%，最大回撤仅4.29% 精准踩点，落袋为安才是硬道理 #量化交易# #ENA# #合约#

"We would see folks build projects on @Solana that they couldn’t build anywhere else.” @Austin_Federa on how Solana’s technical choices enabled the growth of the ecosystem.

Honoured to be backed by @pumpdotfun as the 11th winner of the Build in Public hackathon. Daydreams is an AI products lab. TASKMARKET is the enactment of our thesis on agentic commerce, drafted as standards ERC-8194 and ERC-8195. The time for it is now. <TMV2>

6小时稳稳落袋！ENA空单 现货仅跌4%，20X杠杆直接拿下77.25%收益 多空七杀全拿捏，策略上线2年+无杠杆累计收益526.66% 精准踩点，落袋为安才是硬道理 #量化交易# #ENA# #合约#

夏はもうすぐそこだよ〜！☺️🌴☀️ 📸✨お知らせ✨📸 6/20 📍大阪・久宝寺緑地プールで開催される 「BFF撮影会」に出演させていただきます☺️🤍 🎫チケット発売中✨ 🔗 数量限定の【1DAY PASS】もあるみたいなので、ぜひお早めにチェックしてくださいね🫶 緊張するので会いにきてくれたらすっごく嬉しいな☺️📸✨ @BFF_EVENT #BFFPPS# #ena# #cjd_ena# #cyberjapan# #撮影会#

Intel’s EMIB Packaging Is Growing Rapidly — Silicon Capacitors Are Taking Off Too Silicon capacitors are poised for explosive growth in the AI semiconductor space. Intel has been found to be planning a large-scale adoption of silicon capacitors starting next year, in order to enhance the performance of its in-house 2.5D packaging technology, “EMIB.” The most clearly visible source of demand is Google. Google plans to launch its next-generation AI accelerator, “v8e,” in the second half of next year, and has adopted an EMIB substrate with embedded silicon capacitors for that chip. With other Big Tech companies such as Amazon also currently applying EMIB, analysts say demand could increase sharply. According to industry sources on the 27th, Intel plans to apply silicon capacitors to its 2.5D packaging starting next year. Intel Adopts “Silicon Capacitors” for 2.5D Packaging… Google AI Chip Gets First Application 2.5D is an advanced packaging technology that inserts a thin-film interposer between the semiconductor and the substrate. Because it can connect circuits at higher density compared with conventional packaging that uses only a substrate, demand is rising in the AI and HPC fields. To improve cost efficiency in 2.5D packaging, Intel devised its own technology called EMIB. Rather than using a broad, spread-out interposer, EMIB connects chip to chip using a small silicon bridge. Since bridges only need to be placed where chip-to-chip connections are required, chips can be arranged more flexibly and efficiently. Recently, EMIB has been drawing attention as an alternative to TSMC, which had been leading the existing 2.5D packaging market. This is because TSMC’s 2.5D packaging capacity is suffering from a supply shortage amid the rapid development of the AI industry. Indeed, global Big Tech player Google is also paying attention to EMIB. Google has decided to adopt EMIB for its in-house AI semiconductor “v8e,” which it plans to launch in the second half of next year. Under this structure, TSMC handles chip mass production, MediaTek handles design and manufacturing support, and Intel handles packaging. However, there have been concerns that EMIB is gradually showing limitations in providing stable power supply for AI semiconductors, which consume large amounts of power. Accordingly, Intel plans to introduce new technologies such as silicon capacitors and through-silicon vias (TSV) to ensure stable packaging for the v8e. A capacitor is a component that stores and releases electricity in an electronic circuit. In the case of silicon capacitors, their resistance (ESL/ESR) is more than 100 times lower than that of conventional multilayer ceramic capacitors (MLCC), minimizing the signal loss that occurs in high-performance semiconductors. They can also be designed in an ultra-thin structure based on a silicon wafer, enabling high-density integration. A semiconductor industry official explained, “Because the voltage drop (the phenomenon of voltage decreasing) that occurs in the high-frequency region within AI chips is difficult to solve with MLCC, we understand that Intel is adopting silicon capacitors as a solution,” adding, “The relevant supply chain is now in place, and mass production is set to begin in earnest next year.” EMIB-T Is Already on a Growth Trajectory — The Related Ecosystem and Market Are Expanding Together Intel has also inserted TSVs, which serve as power-delivery channels, into the silicon bridge. The key point is that by using TSVs to shorten the power-delivery path between the substrate and the chip, Intel has improved power efficiency and signal integrity. Intel calls this “EMIB-T.” The industry expects the EMIB-T and silicon capacitor markets to grow rapidly. This is because Japan’s Ibiden — one of the major companies that mass-produces semiconductor substrates for EMIB-T — is aggressively pursuing capital investment. Previously, Ibiden had planned to build its Kawashima (Gama) plant in Gifu Prefecture as a substrate plant for Intel CPUs. However, it postponed that schedule and decided in the first half of this year to officially convert the Gama plant into a mass-production line for EMIB-T substrates. The investment is 220 billion yen (about KRW 2.1 trillion). In its recent earnings announcement, Ibiden stated, “Operation of the Gama plant will begin in 2027 and enter full-scale mass production in 2028,” adding, “EMIB-T substrate capacity is currently far short of demand. However, adding further capacity is quite difficult, so we are discussing options with our customers.” A semiconductor industry official explained, “Ibiden’s EMIB-T-dedicated line is being built with most of the investment coming from customers such as Google, Amazon, and Intel,” adding, “This demonstrates that AI semiconductors based on EMIB-T will grow significantly going forward, and silicon capacitors are likely to expand alongside them.”

Ayar Labs and Wiwynn are partnering to bring CPO to rack-scale AI systems that support next-generation hyperscale AI workloads. By combining Ayar Labs’ CPO solution with Wiwynn’s rack-level system design and manufacturing capabilities, the two companies are enabling a new class of rack-scale AI infrastructure.

Today in Tampa, I outlined the Save Our Homes from Excessive Property Taxes plan that will eliminate taxes on homesteads.  Property tax revenue collected by local governments has nearly doubled in the past seven years (from $32 billion to $60 billion) and is expected to reach an astounding $83 billion by 2032. Florida homeowners need relief. Now is the time to stand up for taxpayers, enact a historic reform, and save the home of every Floridian.