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$AMD| The FOMO to buy @AMD Chips is NOW 🧵 Not Financial Advice! DYOR! Research Purpose Only! The Inference Queen is the biggest winner in Agentic AI where all other CPUs are struggling to compete with a 2yr old EPYC Turin and EPYC Venice is in mass production phase. AMD stresses deployability today on standard x86 platforms (no proprietary architectures required), full software compatibility, and open standards. This positions Venice + Helios as a practical, high-density alternative to competing solutions while underscoring that agentic AI shifts the balance toward CPU-rich racks alongside GPUs, and most importantly, lowering the cost of token to accelerate adoption and innovation. Context: @WSJ yesterday came out with an article that @OpenAI is condiering drasstically lowering the token prices to win more customers from Anthropic. The narrative "they" are trying to exacerbate the current AI selloff won't last long. This is a fundamental misunderstanding of what is going on, or what I already discussed for months and years. Followers and Subscribers already knew this for years, that this day would come, where token cost will bcome the central discussion among enterprises as there is no such thing as unlimited budget or Tokenmaxxing when they use $NVDA chips or In-house Hyperscalers chips. I will link various threads if you are interested in understanding the full picture from supply chain to recent TSMC Rapid 2nm expansion up to 12 Fabs total by 2027/2028. Hyperscalers and AI natives effectively have no choice but to buy more AMD system for Agentic AI as leadership in economical, power-aware, high-volume internal + agentic use. However, due to supply constraints where Supply is far behind Demand, this makes multi-vendor reality along with in-house chips drive faster industry progress, lower overall costs, and better sustainability. NVIDIA’s Vera Rubin cannot compete with a 2 years old EPYC Turin, but AMD under Dr. Lisa Su has engineered the lowest cost-per-million-tokens, highly competitive energy-efficient solutions, and superior CPU orchestration for agentic AI at scale with Helios. Dr. Su has championed this shift since at least 2023, foreseeing the rise of agentic workflows that demand far more orchestration, parallel agents, and balanced compute well before the industry fully embraced it. Her long-term vision of AI moving from simple prompts to always on, multi-agent systems has driven AMD’s investments in high-core EPYC CPUs and integrated rack-scale solutions, perfectly positioning the company for today’s realities. The OpenAI-AMD 1GW Helios deployment (starting H2 2026) represents a pivotal vertical integration move that directly supercharges the inference economics. This isn't incremental; it's a structural shift toward ownership of massive, optimized rack-scale capacity, enabling the lowest token costs and triggering the enterprise adoption flywheel. We need to be honest, $AMD is the only company that made a big bet on Inference since the day Chatgpt became sensational where $NVDA and others were betting big on Training. At the end of the day, Token bill from @AnthropicAI has to obey economics. Meaning the bills rise, companies have to get more out of it to justify the cost. It cannot be an unlimited inference budget, and it has to show up on efficiency, profitability and operating leverage. 1. Tokenomics After you understand this, you will understand why Citi cited @AnthropicAI is likely to sign a deal with $AMD along with Hyperscalers, AI Labs, Sovereign AI like Softbank 5GW in France and many other countries. However, OpenAI and $META are now wanting faster deployment, and they are AMD shareholders now, they have prioritized allocation. Anthropic and Hyperscalers just cannot compete when Helios Rack lower token cost to$0.0003–$0.0005 per million tokens at GW scale. Cost to build 1GW data center 1GW Helios Rack full build is estimated $30-$35B 1GW Rubin Rack full build is estimated $45-$55B Inference (Cost per Million Tokens) ~$NVDA B200 / HGX: ~$0.02–$0.08 on optimized workloads (FP4/MXFP4, speculative decoding). Significant improvement over Hopper but still premium-priced. GB200 NVL72 rack-scale: $0.05–$0.25+ ~$AMD Helios Racks: $0.0003-$0.0005 per M tokens, dramatically lower than NVIDIA equivalents in owned infra. MI355X node-level: Up to 40% more tokens per dollar vs. competing solutions ( B200), driven by higher memory capacity (up to 288GB+ HBM), strong bandwidth, and lower acquisition costs. Training ~$NVDA Rubin Rack is estimated $0.7-$1.2/M Tokens ~$AMD Helios Rack is estimated $0.65-$1.0/M Tokens Now, OpenAI, META and Hyperscalers can lower Inference cost even further with $AMD EPYC Venice "dense rack" or Agentic AI Rack. AMD published a detailed technical blog emphasizing that the future of agentic AI autonomous, multi-step AI systems requiring heavy orchestration, databases, caching, APIs, and control planes demands massive CPU-dense rack-scale infrastructure, not just GPUs. The catalyst prominently positions their upcoming 6th Gen EPYC "Venice" processors as the key enabler for next-generation dense racks, delivering leadership throughput under real-world power, cooling, and density constraints. ~EPYC Venice (Zen 6 architecture, up to 256 cores / 512 threads per socket) is projected to deliver exceptional rack-level performance. In AMD’s modeled 100 kW rack comparisons, Venice-powered systems are expected to achieve ~3.30x the throughput of NVIDIA’s Vera (88-core Olympus) baseline across a broad mix of agentic-supporting workloads. ~This builds on current-generation 5th Gen EPYC "Turin" (up to 192 cores), which already delivers ~2.37x rack throughput vs. Vera and ~1.6x vs. Intel’s Xeon 6980P (128 cores). ~ Liquid-cooled Turin deployments already support >27,000 CPU cores per rack today. Venice is architected to push this beyond 36,000 cores in the same rack class, dramatically increasing concurrent agent capacity and overall infrastructure efficiency. 2. Ownership vs renting compute from Hyperscalers matter to OpenAI and only owning $AMD chips can meaningfully lower token cost for enterprises. ~Eliminates cloud overhead: No provider margins, utilization buffers, or egress fees. Direct control over power contracts, cooling, scheduling, and orchestration at dedicated facilities. ~Helios optimizations at GW scale: Rack-level density (1.4+ exaFLOPS FP8 per rack), high HBM4 bandwidth, EPYC orchestration for agentic workloads, and superior TCO/TDP. AMD's long-standing focus on tokens per dollar/watt shines here 20-40%+ efficiency edges in inference-heavy scenarios. ~At 1GW+ optimized deployment, inference hits $0.0003–$0.0005 per million tokens (community/analyst models tied to Helios metrics). This is dramatically lower than typical rented/cloud equivalents, especially for high-volume output tokens in agentic flows. High token bills today, enterprises running heavy agentic/coding/analysis workloads can face $50-100M+/month at current API rates (flagship models $5-30+/M output, scaled to massive volumes). Post-Helios compression, same volume will drop to $10-15M/month (or better) via lower underlying costs passed through as pricing flexibility, volume tiers, caching, or batch discounts. ROI thresholds collapse. More companies greenlight pilots → production → massive scaling. Agentic AI (autonomous workflows) multiplies token demand exponentially, but affordability removes the friction. OpenAI gains flexibility, Unlike more cloud-dependent rivals (Anthropic), they can lower effective pricing, offer aggressive enterprise bundles, or absorb volume without margin destruction directly tackling "high token bill" complaints while maintaining profitability as usage explodes. 3. Agentic AI Models shifted CPU:GPU Ratio to 1:1 toward 3-5:1 with Explosively Token-Hungry Workloads Agentic AI (autonomous, multi-step agents with planning, tool use, iteration, and self-correction) is fundamentally more compute and token intensive than conversational or single-turn generative AI. Agentic AI. autonomous, multi-step workflows with orchestration, tool use, parallel agents, data movement, and enterprise integration has dramatically increased the importance of strong host CPUs alongside GPUs. This shifts the CPU-to-GPU ratio higher and makes balanced systems critical toward 1:1 to 5:1 as enterprises testing more than 5-10 agents. AMD EPYC Venice excels ~Leadership core density (up to 256 Zen 6 cores per socket) for running many agents in parallel, orchestration layers, and high-throughput control-plane tasks. ~Superior performance-per-core and power efficiency ( up to 2.1x higher perf/core and 2.26x better SPECpower vs. NVIDIA Grace in benchmarks). ~Tight integration in Helios: One Venice CPU + multiple MI450 GPUs per node, enabling efficient data feeding to GPUs ("zero-copy"), parallel execution, and full rack utilization for complex agentic loops. Hyperscalers (Meta, Microsoft, Amazon, Google, Softbank) and AI natives (OpenAI, Anthropic...) are adopting high-core EPYC at scale specifically for these agentic demands, as CPUs now handle a larger share of non-model work (orchestration, policy enforcement, tool calls). This complements AMD’s lower-cost GPUs for overall TCO wins. ~Agents often generate 10–100x+ more tokens per task due to iterative reasoning chains, multiple tool calls, verification loops, and long-context orchestration. ~Goldman Sachs forecasts token consumption multiplying 24x by 2030 (to 120 quadrillion tokens/month) largely driven by agentic adoption in consumer and enterprise. ~Enterprise data shows agent-pattern workloads growing at 680% annualized rates, projected to surpass conversational AI in token volume by Q3 2026. ~Daily enterprise agent token consumption is already in the billions, with complex workflows (coding, workflows, analysis) amplifying this dramatically. 4. Competitive Edge: Winning Customers from Anthropic Anthropic’s Claude models (especially Opus/Sonnet) excel in complex reasoning and agentic coding, commanding premium positioning. However, their higher underlying costs (heavier reliance on third-party cloud with margins) limit pricing flexibility compared to OpenAI’s owned Helios capacity. Anthropic is on track to generate $10.9 billion in Q2 revenue. The company expects to achieve its first-ever quarterly adjusted operating profit of $559 million. However, sustaining full-year profitability remains challenging due to immense computing and model training costs The truth is, Anthropic has no choice but to buy as much $AMD chips as possible if they want to compete with OpenAI or get investors attention. This 5% adjusted operating profit to revenue ratio is just pathetic. Current pricing dynamics (2026): OpenAI already undercuts on many tiers ( flagship output tokens significantly cheaper than equivalent Claude Opus). Nano/mini models offer 5–10x advantages for volume work. Anthropic holds edges in long-context flat pricing and certain reasoning quality. OpenAI after Helios Rack Ownership, At $0.0003–$0.0005/M effective costs, OpenAI gains massive headroom to: ~Aggressively discount high-volume agentic tiers or bundles. ~Offer “unlimited” enterprise plans or usage-based models that Anthropic struggles to match without margin erosion. ~Target cost-sensitive, high-throughput agent deployments (dev tools, automation platforms) where token bills explode. Enterprises facing $ millions in monthly agentic bills will migrate to the provider delivering better economics at scale. OpenAI’s combination of strong models (o-series reasoning) + lowest TCO positions it to erode Anthropic’s enterprise share, especially as agentic becomes the dominant token consumer. Cheaper tokens expand the total addressable market dramatically. This feeds the data/model improvement loop, justifying further capex. AMD benefits from proven scale pulling in more customers (Meta, Oracle, Microsfot, Amazon, Softbank, TensorWave, LumaAI ... already aligned on Helios). Conclusion: Dr. Lisa Su has been laser focused on inference economics since at least 2022–2023, repeatedly emphasizing that the real battleground for AI scalability would be TCO, power efficiency (TDP), and ultimately tokens per dollar and per watt not just raw training FLOPS. While many viewed inference as a secondary, commoditized workload, Dr. Su architected AMD’s roadmap around rack-scale systems optimized for high-volume, sustained inference that would dominate as models matured and usage exploded. Helios represents the culmination of that multi-year bet: a fully integrated, open platform designed precisely for the economics of massive token throughput. This deep, strategic partnership with OpenAI starting with the 1GW Helios deployment in H2 2026 and scaling to 6GW, is the embodiment of that shared vision. Both companies foresaw a future where agentic AI models evolve to become extraordinarily token-hungry: autonomous agents executing complex, iterative workflows with planning, tool use, verification loops, and long-context reasoning. These workloads can consume 100x+ more tokens per task than traditional chat or single-turn generation, driving exponential demand as capabilities improve and enterprises deploy them at scale. By owning and optimizing this massive Helios capacity at GW scale, OpenAI achieves inference costs as low as $0.0003–$0.0005 per million tokens. This structural cost advantage allows OpenAI to absorb the coming token explosion profitably, dramatically lower effective pricing for enterprises, and win high-volume agentic workloads from higher-cost competitors like Anthropic. What was once a prohibitive monthly token bill becomes an affordable accelerator for productivity and innovation. The OpenAI-AMD alliance validates Dr. Su’s prescient strategy and turns the Agentic flywheel into reality: Collapsing inference costs → explosive token consumption → richer data and better models → accelerate greater demand. This partnership doesn’t just address today’s economics, it positions both leaders at the center of the infrastructure buildout that will power AI’s next decade. By delivering the lowest inference economics at scale, OpenAI not only solves enterprise bill pain but gains a decisive weapon to win share from higher-cost rivals like Anthropic. And that is why @OpenAI and $META will deploy EPYC Dense Rack Not Financial Advice! DYOR! Research Purpose Only!

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$SIVE looks like both a chokepoint and a bottleneck for CPO next year. Keep seeing information published from nontechnical people who miss any nuances. Here’s the reason why: 1. CW lasers are bottlenecked signaled by $LITE earnings. Laser fabs are heavily allocated to EML likely from former $NVDA contracts. -> Sumitomo/Furukawa = bottleneck -> Win Semi = bottleneck $SIVE does fab-lite, so are they a bottleneck? Yes, $SIVE sits in the laser bottleneck since control output supply of CW lasers from Win Semi and other fabs from allocation way early on (CEO stated they working with more capacity from other players as well). Perfect example is Kioxia/Sandisk. $SNDK controls NAND output, so they’re a bottleneck because they control final pricing. Demand exceeding supply from Ayar, Jabil, other pluggable vendors + Nvidia NVLink CPO ecosystem… final laser supply owned by $SIVE makes Sivers a bottleneck. $SIVE is also likely primary/sole source for Jabil, Gen-1 Ayar, $MRVL Celestial, and other hyperscaler asic/merchant CPO routes. So no way to get around it (can’t hot-swap single channel cw lasers with Sivers) 2. $SIVE is a chokepoint over CPO. $NVDA use $COHR, $LITE (which likely sources external cw capacity from Japanese competitors) $AVGO is likely vertically integrated as well. However: the entire ecosystem around it from ASIC programs (Marvell, AlChip, etc) and merchant programs (Ayar, Lightmatter, Lightelligence) Are all likely designed around $SIVE. Ayar for example, likely tried to multi-source with $MTSI / $LITE back in 2022 but their lasers probably couldn’t match the level of Sivers specification with arrays (removed Lumentum / Macom from their supply chain site recently) If there’s no alternative at least for the initial generations (obviously they’re working to multi-source). That makes $SIVE a structural chokepoint to go through for lasers. Even if you look at the 1.6T LRO $JBL designed, they achieved a “drastic moat” with performance built around $SIVE likely sole source. $SIVE is also the foundry level reference laser design for $GFS, which your hyperscalers use like $AMD (likely using Sivers + maybe Ayar for gen1): If every major player, who hasn’t achieved vertical integration (Nvidia/Broadcom) is using Sivers for CPO… That makes them a chokepoint. Just look at the entire CPO $NVDA NVLink ecosystem partners: every single one are all likely using Sivers. And they all use $GFS as well (where Sivers is default reference). So $SIVE is both a chokepoint and bottleneck when CPO really scales up H2 2027, over one of the biggest architectural shifts of all time (near $0 -> $81B or $91B TAM in the next 1 1/2 years from GS research note) This is why I say $SIVE looks like it could be the next $75B $LITE over the next couple years. All of this should play out next year. And it’s still trading less than a company with $50M in purchase agreements that buys Sivers lasers to repackage them.

Some LC-36 updates. Now that we’ve had access to the pad and integration facility we can share a bit of good news. The propellant farm, oxygen, liquid hydrogen and LNG tanks are all in good shape. This is good luck because these are very long lead items. The water tower is also good. The big support tower is damaged, but it can be repaired in place rather than torn down and replaced. The booster “Never Tell Me The Odds” and the three GS-2s that were onsite in the integration facility also look good. I’ve seen some speculation that we might move directly to the 9x4 configuration, but we won’t do that. Rate manufacturing of 7x2 is going well, and we’re going to continue that at pace as planned and store the stages for use. In addition, we had already been working for some time on eliminating our transporter-erector in favor of an alternative vertical conop, and we’ll now go directly to that; so we don’t need a new transporter-erector. We will fly again before the end of this year. Gradatim Ferociter.

PewDiePie has launched his free self-hosted AI workspace called 'Odysseus' He described the ChatGPT alternative as a “self-hosted interface for talking to language models”, with features like “chat, autonomous agents, tools, model serving, email, research, and more”

A new open-source office suite called Euro-Office is preparing for its first stable release on June 9, 2026. The project is backed by a coalition of European technology companies, including Nextcloud, IONOS, XWiki, OpenProject, Soverin, and others. They want to provide organizations with a productivity suite developed, governed, and hosted under European control. Euro-Office includes online tools for documents, spreadsheets, presentations, and PDFs, with support for Microsoft Office file formats such as DOCX, XLSX, and PPTX. The interface is designed to feel familiar to Microsoft Office users. What makes the project different is its focus on digital sovereignty: - Fully open source under the AGPL license. - Real-time collaboration. - Support for Microsoft Office and OpenDocument formats. - Self-hosting options for complete data control. - Integration with platforms such as Nextcloud. European governments and organizations are increasingly concerned about dependence on foreign technology providers and seek alternatives that let them retain control over their infrastructure and information.

Intel’s EMIB Packaging Is Growing Rapidly — Silicon Capacitors Are Taking Off Too Silicon capacitors are poised for explosive growth in the AI semiconductor space. Intel has been found to be planning a large-scale adoption of silicon capacitors starting next year, in order to enhance the performance of its in-house 2.5D packaging technology, “EMIB.” The most clearly visible source of demand is Google. Google plans to launch its next-generation AI accelerator, “v8e,” in the second half of next year, and has adopted an EMIB substrate with embedded silicon capacitors for that chip. With other Big Tech companies such as Amazon also currently applying EMIB, analysts say demand could increase sharply. According to industry sources on the 27th, Intel plans to apply silicon capacitors to its 2.5D packaging starting next year. Intel Adopts “Silicon Capacitors” for 2.5D Packaging… Google AI Chip Gets First Application 2.5D is an advanced packaging technology that inserts a thin-film interposer between the semiconductor and the substrate. Because it can connect circuits at higher density compared with conventional packaging that uses only a substrate, demand is rising in the AI and HPC fields. To improve cost efficiency in 2.5D packaging, Intel devised its own technology called EMIB. Rather than using a broad, spread-out interposer, EMIB connects chip to chip using a small silicon bridge. Since bridges only need to be placed where chip-to-chip connections are required, chips can be arranged more flexibly and efficiently. Recently, EMIB has been drawing attention as an alternative to TSMC, which had been leading the existing 2.5D packaging market. This is because TSMC’s 2.5D packaging capacity is suffering from a supply shortage amid the rapid development of the AI industry. Indeed, global Big Tech player Google is also paying attention to EMIB. Google has decided to adopt EMIB for its in-house AI semiconductor “v8e,” which it plans to launch in the second half of next year. Under this structure, TSMC handles chip mass production, MediaTek handles design and manufacturing support, and Intel handles packaging. However, there have been concerns that EMIB is gradually showing limitations in providing stable power supply for AI semiconductors, which consume large amounts of power. Accordingly, Intel plans to introduce new technologies such as silicon capacitors and through-silicon vias (TSV) to ensure stable packaging for the v8e. A capacitor is a component that stores and releases electricity in an electronic circuit. In the case of silicon capacitors, their resistance (ESL/ESR) is more than 100 times lower than that of conventional multilayer ceramic capacitors (MLCC), minimizing the signal loss that occurs in high-performance semiconductors. They can also be designed in an ultra-thin structure based on a silicon wafer, enabling high-density integration. A semiconductor industry official explained, “Because the voltage drop (the phenomenon of voltage decreasing) that occurs in the high-frequency region within AI chips is difficult to solve with MLCC, we understand that Intel is adopting silicon capacitors as a solution,” adding, “The relevant supply chain is now in place, and mass production is set to begin in earnest next year.” EMIB-T Is Already on a Growth Trajectory — The Related Ecosystem and Market Are Expanding Together Intel has also inserted TSVs, which serve as power-delivery channels, into the silicon bridge. The key point is that by using TSVs to shorten the power-delivery path between the substrate and the chip, Intel has improved power efficiency and signal integrity. Intel calls this “EMIB-T.” The industry expects the EMIB-T and silicon capacitor markets to grow rapidly. This is because Japan’s Ibiden — one of the major companies that mass-produces semiconductor substrates for EMIB-T — is aggressively pursuing capital investment. Previously, Ibiden had planned to build its Kawashima (Gama) plant in Gifu Prefecture as a substrate plant for Intel CPUs. However, it postponed that schedule and decided in the first half of this year to officially convert the Gama plant into a mass-production line for EMIB-T substrates. The investment is 220 billion yen (about KRW 2.1 trillion). In its recent earnings announcement, Ibiden stated, “Operation of the Gama plant will begin in 2027 and enter full-scale mass production in 2028,” adding, “EMIB-T substrate capacity is currently far short of demand. However, adding further capacity is quite difficult, so we are discussing options with our customers.” A semiconductor industry official explained, “Ibiden’s EMIB-T-dedicated line is being built with most of the investment coming from customers such as Google, Amazon, and Intel,” adding, “This demonstrates that AI semiconductors based on EMIB-T will grow significantly going forward, and silicon capacitors are likely to expand alongside them.”