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中国决定将20家日本实体列入出口管制管控名单 1. 防卫研究所（National Institute for Defense Studies） 2. 陆上装备研究所（Ground Systems Research Center） 3. 舰艇装备研究所（Naval Systems Research Center） 4. 航空装备研究所（Air Systems Research Center） 5. 日钢特机株式会社（NIKKO TOKKI Co., Ltd.） 6. 日钢YPK商事株式会社（NIKKO-YPK SHOJI Co., Ltd.） 7. 三菱电机防卫与空间技术株式会社（Mitsubishi Electric Defense and Space Technologies Corporation） 8. 三菱电机软件株式会社（Mitsubishi Electric Software Corporation） 9. 三菱电机工程株式会社（Mitsubishi Electric Engineering Company, Limited） 10. 三菱精密株式会社（Mitsubishi Precision Company, Limited） 11. 三菱重工海洋技术株式会社（MHI Oceanincs Co., Ltd.） 12. 三菱重工相模高科技株式会社（MHI Sagami High-tech, Ltd.） 13. 三菱重工物流技术株式会社（MHI Logitec Co., Ltd.） 14. 光和兴业株式会社（KOWA KOGYO, Ltd.） 15. 菱重特殊车辆服务株式会社（MHI Special Vehicles Parts Supply & Technical Service Co., Ltd.） 16. 三菱重工海事技术株式会社（MHI Maritech, Co., Ltd.） 17. KGM株式会社（Kawajyu Gifu Manufacturing Co., Ltd.） 18. 日本飞机株式会社（NIPPI Corporation） 19. 福图尼奥株式会社（Fortunio Co., Ltd.） 20. 青木精密工业株式会社（Aoki Seimitsu Kogyo Co., Ltd.）

Intel’s EMIB Packaging Is Growing Rapidly — Silicon Capacitors Are Taking Off Too Silicon capacitors are poised for explosive growth in the AI semiconductor space. Intel has been found to be planning a large-scale adoption of silicon capacitors starting next year, in order to enhance the performance of its in-house 2.5D packaging technology, “EMIB.” The most clearly visible source of demand is Google. Google plans to launch its next-generation AI accelerator, “v8e,” in the second half of next year, and has adopted an EMIB substrate with embedded silicon capacitors for that chip. With other Big Tech companies such as Amazon also currently applying EMIB, analysts say demand could increase sharply. According to industry sources on the 27th, Intel plans to apply silicon capacitors to its 2.5D packaging starting next year. Intel Adopts “Silicon Capacitors” for 2.5D Packaging… Google AI Chip Gets First Application 2.5D is an advanced packaging technology that inserts a thin-film interposer between the semiconductor and the substrate. Because it can connect circuits at higher density compared with conventional packaging that uses only a substrate, demand is rising in the AI and HPC fields. To improve cost efficiency in 2.5D packaging, Intel devised its own technology called EMIB. Rather than using a broad, spread-out interposer, EMIB connects chip to chip using a small silicon bridge. Since bridges only need to be placed where chip-to-chip connections are required, chips can be arranged more flexibly and efficiently. Recently, EMIB has been drawing attention as an alternative to TSMC, which had been leading the existing 2.5D packaging market. This is because TSMC’s 2.5D packaging capacity is suffering from a supply shortage amid the rapid development of the AI industry. Indeed, global Big Tech player Google is also paying attention to EMIB. Google has decided to adopt EMIB for its in-house AI semiconductor “v8e,” which it plans to launch in the second half of next year. Under this structure, TSMC handles chip mass production, MediaTek handles design and manufacturing support, and Intel handles packaging. However, there have been concerns that EMIB is gradually showing limitations in providing stable power supply for AI semiconductors, which consume large amounts of power. Accordingly, Intel plans to introduce new technologies such as silicon capacitors and through-silicon vias (TSV) to ensure stable packaging for the v8e. A capacitor is a component that stores and releases electricity in an electronic circuit. In the case of silicon capacitors, their resistance (ESL/ESR) is more than 100 times lower than that of conventional multilayer ceramic capacitors (MLCC), minimizing the signal loss that occurs in high-performance semiconductors. They can also be designed in an ultra-thin structure based on a silicon wafer, enabling high-density integration. A semiconductor industry official explained, “Because the voltage drop (the phenomenon of voltage decreasing) that occurs in the high-frequency region within AI chips is difficult to solve with MLCC, we understand that Intel is adopting silicon capacitors as a solution,” adding, “The relevant supply chain is now in place, and mass production is set to begin in earnest next year.” EMIB-T Is Already on a Growth Trajectory — The Related Ecosystem and Market Are Expanding Together Intel has also inserted TSVs, which serve as power-delivery channels, into the silicon bridge. The key point is that by using TSVs to shorten the power-delivery path between the substrate and the chip, Intel has improved power efficiency and signal integrity. Intel calls this “EMIB-T.” The industry expects the EMIB-T and silicon capacitor markets to grow rapidly. This is because Japan’s Ibiden — one of the major companies that mass-produces semiconductor substrates for EMIB-T — is aggressively pursuing capital investment. Previously, Ibiden had planned to build its Kawashima (Gama) plant in Gifu Prefecture as a substrate plant for Intel CPUs. However, it postponed that schedule and decided in the first half of this year to officially convert the Gama plant into a mass-production line for EMIB-T substrates. The investment is 220 billion yen (about KRW 2.1 trillion). In its recent earnings announcement, Ibiden stated, “Operation of the Gama plant will begin in 2027 and enter full-scale mass production in 2028,” adding, “EMIB-T substrate capacity is currently far short of demand. However, adding further capacity is quite difficult, so we are discussing options with our customers.” A semiconductor industry official explained, “Ibiden’s EMIB-T-dedicated line is being built with most of the investment coming from customers such as Google, Amazon, and Intel,” adding, “This demonstrates that AI semiconductors based on EMIB-T will grow significantly going forward, and silicon capacitors are likely to expand alongside them.”

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FM GIFU「Meets up Friday」@MeetsupFriday 生出演させていただきました🐟 久世良輔さん、高木由麻奈さん、おふたりとのサッカートークも嬉しかったです⚽️公開生放送、見てくださったみなさんもありがとうございました〜〜！ radikoはこちらです▽ #fmgifu# #risa_montage#