Intel’s EMIB Packaging Is Growing Rapidly — Silicon Capacitors Are Taking Off Too
Silicon capacitors are poised for explosive growth in the AI semiconductor space. Intel has been found to be planning a large-scale adoption of silicon capacitors starting next year, in order to enhance the performance of its in-house 2.5D packaging technology, “EMIB.”
The most clearly visible source of demand is Google. Google plans to launch its next-generation AI accelerator, “v8e,” in the second half of next year, and has adopted an EMIB substrate with embedded silicon capacitors for that chip. With other Big Tech companies such as Amazon also currently applying EMIB, analysts say demand could increase sharply.
According to industry sources on the 27th, Intel plans to apply silicon capacitors to its 2.5D packaging starting next year.
Intel Adopts “Silicon Capacitors” for 2.5D Packaging… Google AI Chip Gets First Application
2.5D is an advanced packaging technology that inserts a thin-film interposer between the semiconductor and the substrate. Because it can connect circuits at higher density compared with conventional packaging that uses only a substrate, demand is rising in the AI and HPC fields.
To improve cost efficiency in 2.5D packaging, Intel devised its own technology called EMIB. Rather than using a broad, spread-out interposer, EMIB connects chip to chip using a small silicon bridge. Since bridges only need to be placed where chip-to-chip connections are required, chips can be arranged more flexibly and efficiently.
Recently, EMIB has been drawing attention as an alternative to TSMC, which had been leading the existing 2.5D packaging market. This is because TSMC’s 2.5D packaging capacity is suffering from a supply shortage amid the rapid development of the AI industry.
Indeed, global Big Tech player Google is also paying attention to EMIB. Google has decided to adopt EMIB for its in-house AI semiconductor “v8e,” which it plans to launch in the second half of next year. Under this structure, TSMC handles chip mass production, MediaTek handles design and manufacturing support, and Intel handles packaging.
However, there have been concerns that EMIB is gradually showing limitations in providing stable power supply for AI semiconductors, which consume large amounts of power. Accordingly, Intel plans to introduce new technologies such as silicon capacitors and through-silicon vias (TSV) to ensure stable packaging for the v8e.
A capacitor is a component that stores and releases electricity in an electronic circuit. In the case of silicon capacitors, their resistance (ESL/ESR) is more than 100 times lower than that of conventional multilayer ceramic capacitors (MLCC), minimizing the signal loss that occurs in high-performance semiconductors. They can also be designed in an ultra-thin structure based on a silicon wafer, enabling high-density integration.
A semiconductor industry official explained, “Because the voltage drop (the phenomenon of voltage decreasing) that occurs in the high-frequency region within AI chips is difficult to solve with MLCC, we understand that Intel is adopting silicon capacitors as a solution,” adding, “The relevant supply chain is now in place, and mass production is set to begin in earnest next year.”
EMIB-T Is Already on a Growth Trajectory — The Related Ecosystem and Market Are Expanding Together
Intel has also inserted TSVs, which serve as power-delivery channels, into the silicon bridge. The key point is that by using TSVs to shorten the power-delivery path between the substrate and the chip, Intel has improved power efficiency and signal integrity. Intel calls this “EMIB-T.”
The industry expects the EMIB-T and silicon capacitor markets to grow rapidly.
This is because Japan’s Ibiden — one of the major companies that mass-produces semiconductor substrates for EMIB-T — is aggressively pursuing capital investment.
Previously, Ibiden had planned to build its Kawashima (Gama) plant in Gifu Prefecture as a substrate plant for Intel CPUs. However, it postponed that schedule and decided in the first half of this year to officially convert the Gama plant into a mass-production line for EMIB-T substrates. The investment is 220 billion yen (about KRW 2.1 trillion).
In its recent earnings announcement, Ibiden stated, “Operation of the Gama plant will begin in 2027 and enter full-scale mass production in 2028,” adding, “EMIB-T substrate capacity is currently far short of demand. However, adding further capacity is quite difficult, so we are discussing options with our customers.”
A semiconductor industry official explained, “Ibiden’s EMIB-T-dedicated line is being built with most of the investment coming from customers such as Google, Amazon, and Intel,” adding, “This demonstrates that AI semiconductors based on EMIB-T will grow significantly going forward, and silicon capacitors are likely to expand alongside them.”
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那么多人想看PDD,那我就多说几句。
PDD国内业务的增长基本上就是大盘子的增长了,这部分大家都没有什么额外预期了,所以市场对PDD的预期主要来自于Temu,我们来看下Temu本身的情况。
因为PDD从不单独披露 Temu 的财务数据,所以下面所有数字都来自第三方追踪机构,有一定程度误差,仅供参考。
Temu 当前状态可以概括成一句话:全球总盘子还在涨,但美国市场遭受重创、整体战略被迫从"中国直邮极致低价"转向"本地履约",增速是放缓的。
一:先看规模
全球月活方面,2026 年初的数据显示 Temu 全球月活超过 4.16 亿,其中美国约 1.336 亿、欧盟约 1.416 亿。GMV,2024 年 约 708 亿美元,有预测认为 2026 年可能突破 1000 亿美元。
注意一个关键变化:如今欧盟已占 Temu 全球用户的 34%,欧洲月活已经超过美国,这是过去一年最重要的结构转变,重心明显在向欧洲,所以什么西雅图kol是不懂的,只能看见便宜低质这个事情。
二、美国市场的重创
这是核心事件,导火索是关税政策:2025 年 8 月特朗普政府终止了 De Minimis 规则,此前允许 800 美元以下进口商品免税,这正是 Shein、Temu 赖以低价进入美国的基础)。
后果很严重:2025 年 4 月到 6 月间,Temu 美国月活暴跌 46%,路透报道其美国日活在 2025 年 5 月相比 3 月下跌约 48%。
为应对该情况,Temu 转向本土履约模式,启用美国本地仓库和本地第三方卖家,虽然缓解了关税冲击,但抬高了运营成本、侵蚀了当初赖以崛起的价格优势,转向半托管供应模式后,总商品量减少了 20%-30%。
三、应对美国市场的策略
大致是三条:
1、重心转向欧洲,de minimis 冲击暂时还没全面落地,欧洲扩张带来了 80%-100% 的 GMV 增长,但 欧盟 2026 年也要逐步取消 de minimis,威胁重演美国剧本
2、本地化履约,美欧本地仓+本地卖家手段
3、调低目标,向更多国家铺开,2025 年目标被下调到 750-800 亿美元,Temu目前只在约 100 个国家运营,而 AliExpress、Shein、亚马逊已在 200 多个国家布局,扩张空间还有
四、主要竞争对手有哪些
最直接的同类是另外两家中国跨境低价平台:
1、Shein,快时尚为主,同样受 de minimis 终结重创
2、AliExpress,阿里旗下,老牌跨境平台,国家覆盖更广
这三家是“中国出海低价电商”的铁三角,他们在贴身肉搏。
另外一家是亚马逊,而且亚马逊正主动下场截击,亚马逊推出了 Amazon Haul 和 Amazon Bazaar,对标超低价电商,借助自身物流基础设施提供更快配送和更可靠的退货,在物流可靠性和商品质量上已经超过 Temu,暴露了 Temu 供应链的脆弱性。
这是 Temu 最危险的对手,因为亚马逊有 Temu 最缺的东西——成熟的本地履约网络。
还有形态不一样的TikTok Shop,在社交电商、年轻用户场景里和 Temu 争夺。
有消费者的调查结果显示:美国男性打分Shein
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Coucou mes chats. Pour me rejoindre sur mes différentes plateformes 🔞🔥😘
Mym:
N’hésite pas -50% avec le code LUX50
Liste Amazon si tu veux me faire un cadeau pour participer à mon contenu 🎁 😍:
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$MRVL earnings were a bullish indicator on the broader CPO theme (and $SIVE as the likely laser supplier).
- “Scale-up interconnect represents one of the newest and most strategically important opportunities emerging in AI infrastructure.”
CPO thematically go brrr
- Confirmation Celestial was selected by T1 hyperscaler for scale up.
I’ve found Celestial $AMZN warrants in the past)… so probably Amazon.
- Scale-up optics revenue next year should be more than 2x prior ~$150M outlook with Celestial
Forward revenue ramp expectations go brrr.
- Celestial team plus $MRVL optics team was a “home run”.
Marvell sees celestial as growth vector, upstream celestial suppliers go brr
- $MRVL is now focused on bringing Celestial to high volume manufacturing.
Volume ramp indicator
If you don’t recall, there was OSINT mapping $SIVE directly to Celestial, not through $POET.
So Celestial forward growth is a volume ramp indicator for Sivers lasers.
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.˚⊹⁺‧┈┈┈┈┈┈┈┈┈┈┈┈‧⁺ ⊹˚.
7/16(木)発売❣️
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岸みゆ2nd写真集#
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▷▷▷𝙿𝚁𝙴-𝚁𝙴𝙻𝙴𝙰𝚂𝙴 𝙲𝚄𝚃 📸◁◁◁
光に包まれて…
この表現力、ずるいです🥺
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台湾作家杨双子创作、由金翎英译的作品《台湾漫游录》上周获得国际布克奖。周三(5月27日),中国国台办发言人陈斌华被问及中国是否有可能引进这本书、是否有言论审查考虑;对此,他称"两岸作家都应站稳民族立场",并且正视日本侵略带给中国人和世界人民的巨大伤害。
这个提问是由台湾中央社记者在中国国台办例行记者会所提出。值得注意的是,陈斌华回应时,首先强调了用词差异:"台湾的书籍不是在'中国',(而是)在'大陆'出版。"
上周,杨双子接受法新社采访曾指出,这本书目前在中国还买不到,但她知道仍有中国读者想读;而"如果这本书能够用各种方式进到中国",就有机会促进中国人理解台湾人的想法。她表示,台湾人想要的未来,"跟中国人所想像的并不相同"。
在台湾人常使用的Threads平台上对这本书有许多讨论;中国的豆瓣平台到5月27日为止,亦有200多名网友留下短评。部分读者关注这本书强调的台湾主体性,也有人批评此书"美化殖民"或者"恋殖"。
美国亚马逊(Amazon)的有声书平台Audible也上架了《台湾漫游录》。不过,有网友发现这本书的书籍页面包含了"中国"的标签,遭质疑不尊重捍卫民主自由的台湾人、否定了台湾的身份认同。
你读过这本书了吗?留言分享你的读后感!
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