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Good day fam, A lot of frontier tech dies in the gap between demo and workflow. That is why @quipnetwork feels more serious than it first looks. The interesting part is not just the quantum story. It is the way Quip is trying to fit into tools people already use. Their asset layer wraps existing wallets with a quantum resistant cosigner, already spans Ethereum, Solana, and Bitcoin, and plugs into familiar surfaces like MetaMask, Ledger, and Safe instead of asking users to relearn everything from scratch. ➛ safer transactions without a full wallet migration. ➛ existing habits stay intact while security improves. ➛ 20,000+ deployed wallets show this is beyond theory. ➛ 500+ active nodes mean the supply side is already being tested. That is a much better go to market than waiting for a total industry reset. The winners usually make the transition usable before everyone agrees it is necessary.

$SIVE Q1 2026 컨퍼런스콜 확인 후 결론. 나는 아직 매도할 이유를 찾지 못했다. 물론 Q1 숫자만 보면 좋다고 말하기 어렵다. 매출은 전년 대비 감소했고, AEBITDA도 적자였다. 미국 정부 셧다운, 방산 예산 승인 지연, FX 역풍으로 Q1/Q2 일부 매출이 H2 2026으로 밀렸다는 회사 설명도 확인됐다. 그래서 단기 실적만 보면 실망할 수 있다. 하지만 이번 발표에서 중요한 건 Q1 숫자 자체가 아니라, 2026~2027년 상업화 전환 경로가 더 구체화됐다는 점이라고 본다. 가장 중요한 숫자는 Opportunity Pipeline 799M USD. 2025년 말 453M USD에서 2026년 5월 799M USD까지 증가. 연초 대비 +77%. 물론 이건 확정 매출도 아니고, backlog도 아니고, 수주잔고도 아니다. 정확히는 Opportunity Pipeline이다. 즉 “확보한 매출”이 아니라 “잠재 기회”다. 그래도 SIVE 같은 소형 회사 입장에서는 회사 체급 자체를 바꿀 수 있는 규모의 잠재 기회라고 본다. 내가 이번 자료에서 좋게 본 포인트는 크게 3개다. 첫째, AI Datacenter Optics. Jabil과의 1.6T LRO pluggable transceiver 협력은 중요하다. Jabil은 FY2026 매출 전망 34B USD 규모의 글로벌 제조·공급망 기업이고, Sivers DFB laser를 사용한 1.6T LRO module 개발 계획이 공식 발표됐다. 이건 Sivers laser technology가 AI datacenter optical interconnect 시장에서 검증받는 중요한 단계라고 본다. 다만 아직 production order, volume ramp, revenue contribution은 발표되지 않았다. 여기서 고객 주문으로 전환되는지가 핵심이다. 둘째, SATCOM / Space / Defense. York Space의 ALL SPACE 인수는 Sivers 입장에서 긍정적인 이벤트로 보인다. Sivers는 York이 Space Development Agency와 강한 연관을 가진다고 설명했고, SATCOM 쪽에서 2027 ramp를 위한 new production orders imminent라는 표현도 사용했다. 이 문구는 긍정적이다. 하지만 아직 order won은 아니다. 현재 상태는 order expected에 가깝다. 셋째, DoD / CHIPS Act / Electronic Warfare. EW STAR 프로그램 관련 US CHIPS Act Year 2 funding 6.6M USD도 확보했다. Year 1의 5.6M USD보다 약 18% 높은 규모다. BAE Systems, MIT Lincoln Laboratory, Columbia University와 연결된 전자전 프로그램이라는 점도 중요하다. 단기 매출 크기보다 중요한 건, Sivers 기술이 미국 방산 생태계 안에서 계속 검증되고 있다는 점이라고 본다. 결국 내가 보는 SIVE의 핵심 구조는 이거다. Pipeline → Order Order → Product Revenue Product Revenue → Margin Margin → Cash Flow 아직 완성된 실적주는 아니다. 하지만 이제 완전히 막연한 스토리주라고 보기도 어렵다. Jabil 1.6T AI datacenter lasers SATCOM production order 기대 Tachyon 28GHz production PO 60GHz development partnership Tier-1 telco FWA Automotive / Industrial LiDAR ramp CHIPS Act Year 2 funding 이렇게 여러 전환 포인트가 동시에 보이기 시작했다. 내가 중요하게 보는 건 SIVE thesis가 단일 제품 하나에만 걸린 구조가 아니라는 점이다. AI optics SATCOM FWA LiDAR Defense 여러 옵션 중 몇 개만 실제 주문과 매출로 연결돼도 회사 체급이 달라질 수 있다. 물론 리스크는 분명하다. 799M USD pipeline은 계약이 아니다. Jabil 매출은 아직 없다. SATCOM 주문도 아직 공시되지 않았다. Convertible facility 때문에 희석 가능성도 남아 있다. Nasdaq New York dual listing도 아직 검토 단계일 뿐이다. 그래서 앞으로 봐야 할 것은 네 가지다. SATCOM 실제 production order Jabil 협력의 customer order 전환 H2 2026 방산 매출 회복 2027 product revenue ramp 이 네 가지가 숫자로 확인되면 SIVE thesis는 훨씬 강해진다. 반대로 지연이 반복되면 시장은 799M USD pipeline을 점점 할인해서 볼 것이다. 그래도 현재 확인된 사실 기준으로는, 나는 아직 $SIVE를 매도할 이유를 찾지 못했다. 단기 실적주는 아니다. AI optics / SATCOM / DoD 슈퍼사이클에 걸린 고위험·고수익 상업화 콜옵션에 가깝다. 내 기준에서 SIVE thesis는 아직 살아 있다. 개인 기록. 투자 조언 아님.

邂逅津门美景，拥抱智能时代。在天津的晚风里，看见未来的模样。 #2026世界智能产业博览会# #天津# Discover the charm of Tianjin. Embrace smart technology. See the future unfold in the city’s gentle evening breeze. #WIE2026# #Tianjin#

"We would see folks build projects on @Solana that they couldn’t build anywhere else.” @Austin_Federa on how Solana’s technical choices enabled the growth of the ecosystem.

@MsMelChen The solution is to rally around open source. That's the only way to compete with a superpower technology network effect if you are not a superpower yourself. And it's the only way to bring the rest of the world along on the same team as you. Open source.

最近，风华高科因RC/RS系列0402、0603晶片电阻订单激增，暂停部分新订单。 虽然只是是贴片电阻吗，但重要的，这是，高端、小尺寸、高一致性被动器件，的供需失衡信号。 0402 / 0603是封装尺寸。它既可以是MLCC，也可以是贴片电阻、电感、EMI滤波器。AI服务器真正需要的，是“小尺寸下还能维持高频、高一致性和长期可靠性”的器件。 AI的VRM复杂度提升、PDN越来越复杂。于是系统开始大量消耗：高频MLCC、小尺寸电阻、高频电感、钽电容、HSC。 这些器件单价不高，但属于“缺一个，整机就无法出货”的东西。 AI服务器里的需求本身是分层的。最核心的位置，比如GPU核心供电、HBM附近、ASIC substrate附近，仍然高度依赖：Murata Manufacturing、TDK Corporation、Taiyo Yuden。因为这里要求极低ESL、极低ESR、高频响应和长期可靠性。 但AI服务器并不只有核心位置。PSU、BBU、NIC、SSD、光模块、交换机，同样会消耗海量0402/0603。重要的是，AI正在先抽紧最顶级MLCC产能，然后压力开始向中高端0402/0603扩散。 最近大火的MLCC和0402电阻看起来是不同器件，但背后共享的是“小尺寸精密制造能力”。包括精密印刷、烧结、AOI检测、高频测试、超小尺寸良率控制、精密材料处理。 这和HBM产业链很像。最开始缺的是HBM，后来CoWoS、ABF、substrate、电源、散热、测试一起开始紧张。MLCC现在也开始出现类似现象。 真正最容易缺货的，往往不是最顶级料号，而是“能量产、能过验证、还能部分替代”的中高端规格。 2018年被动器件超级周期就是典型案例。当时车规MLCC先缺，高频小尺寸规格先涨，随后0402/0603全面涨价。因为一旦高端规格开始缺货，客户就会提前备货、长单锁产能、替代采购、超额下单，最后整个产业链一起紧张。 现在AI行业，可能正在重复这个过程。 更重要的是，这种紧缺会向二线供应商传导。当Murata Manufacturing、TDK Corporation、Taiyo Yuden 优先保障AI服务器和车规客户后，订单开始向：Vishay Intertechnology、Yageo Corporation、Bel Fuse Inc.、Fenghua Advanced Technology 溢出。 AI数据中心，正在把整个电子产业重新拉回“工业品逻辑”。从GPU，到HBM，到光模块，到电源，再到0402电阻，整个链条都在同时变紧。 这可能意味着，被动器件行业，正在进入新一轮量价周期。甚至可能是超级周期。 免责声明：本人持有文章中提及资产，观点充满偏见，非投资建议，dyor

XBITDEX × @BullbitDEXHQ We’re excited to announce our partnership with Bullbit — a next-generation perp DEX built on Base, focused on creating an “invisible blockchain” trading experience. Bullbit is rethinking on-chain trading with a CEX-like experience: no seed phrases, no gas fees, and frictionless access powered by passkey login technology. With fast execution, AI Copilot integration, API support, and growing RWA trading pairs, Bullbit is building a simpler and more accessible derivatives trading environment for the next wave of users. As XBIT continues expanding across prediction markets and decentralized trading infrastructure, collaborations with innovative trading ecosystems like Bullbit help push Web3 trading experiences further forward. Together, XBITDEX and Bullbit aim to explore new possibilities in decentralized trading, support broader ecosystem growth, and bring more value and accessibility to users across Web3. 🚀

AI diagnostic tools are transforming #healthcare# by 2026, enhancing accuracy and speeding up detection, but they won’t replace #doctors# entirely. —  @meisshaily #ArtificialIntelligence# #Technology# #TechNews# #Tech# #AI# #Efficiency#

Intel’s EMIB Packaging Is Growing Rapidly — Silicon Capacitors Are Taking Off Too Silicon capacitors are poised for explosive growth in the AI semiconductor space. Intel has been found to be planning a large-scale adoption of silicon capacitors starting next year, in order to enhance the performance of its in-house 2.5D packaging technology, “EMIB.” The most clearly visible source of demand is Google. Google plans to launch its next-generation AI accelerator, “v8e,” in the second half of next year, and has adopted an EMIB substrate with embedded silicon capacitors for that chip. With other Big Tech companies such as Amazon also currently applying EMIB, analysts say demand could increase sharply. According to industry sources on the 27th, Intel plans to apply silicon capacitors to its 2.5D packaging starting next year. Intel Adopts “Silicon Capacitors” for 2.5D Packaging… Google AI Chip Gets First Application 2.5D is an advanced packaging technology that inserts a thin-film interposer between the semiconductor and the substrate. Because it can connect circuits at higher density compared with conventional packaging that uses only a substrate, demand is rising in the AI and HPC fields. To improve cost efficiency in 2.5D packaging, Intel devised its own technology called EMIB. Rather than using a broad, spread-out interposer, EMIB connects chip to chip using a small silicon bridge. Since bridges only need to be placed where chip-to-chip connections are required, chips can be arranged more flexibly and efficiently. Recently, EMIB has been drawing attention as an alternative to TSMC, which had been leading the existing 2.5D packaging market. This is because TSMC’s 2.5D packaging capacity is suffering from a supply shortage amid the rapid development of the AI industry. Indeed, global Big Tech player Google is also paying attention to EMIB. Google has decided to adopt EMIB for its in-house AI semiconductor “v8e,” which it plans to launch in the second half of next year. Under this structure, TSMC handles chip mass production, MediaTek handles design and manufacturing support, and Intel handles packaging. However, there have been concerns that EMIB is gradually showing limitations in providing stable power supply for AI semiconductors, which consume large amounts of power. Accordingly, Intel plans to introduce new technologies such as silicon capacitors and through-silicon vias (TSV) to ensure stable packaging for the v8e. A capacitor is a component that stores and releases electricity in an electronic circuit. In the case of silicon capacitors, their resistance (ESL/ESR) is more than 100 times lower than that of conventional multilayer ceramic capacitors (MLCC), minimizing the signal loss that occurs in high-performance semiconductors. They can also be designed in an ultra-thin structure based on a silicon wafer, enabling high-density integration. A semiconductor industry official explained, “Because the voltage drop (the phenomenon of voltage decreasing) that occurs in the high-frequency region within AI chips is difficult to solve with MLCC, we understand that Intel is adopting silicon capacitors as a solution,” adding, “The relevant supply chain is now in place, and mass production is set to begin in earnest next year.” EMIB-T Is Already on a Growth Trajectory — The Related Ecosystem and Market Are Expanding Together Intel has also inserted TSVs, which serve as power-delivery channels, into the silicon bridge. The key point is that by using TSVs to shorten the power-delivery path between the substrate and the chip, Intel has improved power efficiency and signal integrity. Intel calls this “EMIB-T.” The industry expects the EMIB-T and silicon capacitor markets to grow rapidly. This is because Japan’s Ibiden — one of the major companies that mass-produces semiconductor substrates for EMIB-T — is aggressively pursuing capital investment. Previously, Ibiden had planned to build its Kawashima (Gama) plant in Gifu Prefecture as a substrate plant for Intel CPUs. However, it postponed that schedule and decided in the first half of this year to officially convert the Gama plant into a mass-production line for EMIB-T substrates. The investment is 220 billion yen (about KRW 2.1 trillion). In its recent earnings announcement, Ibiden stated, “Operation of the Gama plant will begin in 2027 and enter full-scale mass production in 2028,” adding, “EMIB-T substrate capacity is currently far short of demand. However, adding further capacity is quite difficult, so we are discussing options with our customers.” A semiconductor industry official explained, “Ibiden’s EMIB-T-dedicated line is being built with most of the investment coming from customers such as Google, Amazon, and Intel,” adding, “This demonstrates that AI semiconductors based on EMIB-T will grow significantly going forward, and silicon capacitors are likely to expand alongside them.”