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Trade on AVE. Bank through PolyFlow. We're excited to announce our partnership with @AveaiGlobal — the leading on-chain trading gateway spanning 130+ chains, 300+ DEXes, and 7M+ users. What is PolyFlow? Built on 20+ years of cross-border payment infrastructure from HuionePayGroup + real-time stablecoin settlement via Circle Payments Network. PolyFlow delivers institutional-grade clearing & settlement with: - PID on-chain identity - PLP non-custodial settlement - Fiat payment gateway orchestration AVE brings the market to you. PolyFlow takes your funds beyond the trade — into accounts, merchants, cards, and cross-border rails. #PolyFlow# #AveAI# #TradeOnAVE# #BankThroughPolyFlow# #PayFi# #StablecoinPayments# #OnchainTrading# #CrossBorderPayments# #DeFi# #Web3Payments#

四年了，也算是经历过牛熊，没白来币圈一趟。 Luna 暴雷时融的种子轮。今天又是寒冬，但我们已不是菜鸟。 建立 PayFi 赛道只是起点，让 T+0 成为国际支付主流还要至少再跨越一个周期。 Buidl 永无止境，我们才刚上路。 P.S. 过生总得有点仪式感 🎂，明早 10 点（SGT），Huma Prime 额度扩容。 OG 和 Anchor 徽章家人们，给你们留了 2 小时的早鸟通道。

AI 正在吸干流动性，Crypto 还有戏吗？ “AI 确实是当下全球最大的共识，所有的钱都在往那边倾斜”，直面这个残酷现实，亲历三个周期的 Yetta 反而看到了机会： Crypto 最惨淡的时候，正是 VC 进场的最好时机。她当下依然坚定押注 PayFi 与 CeDeFi，并笃定 AI 与稳定币的结合才刚刚拉开序幕 本期，Mercy很开心可以对话 Primitive Ventures 投资合伙人 Yetta @YettaSing ！ AI 狂热下 Crypto 的结构性机会——“只要还有人在 AI 里赚钱，流动性迟早会回来”。

Centralized clouds charge you up to 70% more than you need to pay for GPU compute. Not because their chips cost more. Because you're also paying for their electricity, cooling headaches, software bundles, and egress fees. We broke down every option for GPU compute with the actual numbers. Full guide:

Intel’s EMIB Packaging Is Growing Rapidly — Silicon Capacitors Are Taking Off Too Silicon capacitors are poised for explosive growth in the AI semiconductor space. Intel has been found to be planning a large-scale adoption of silicon capacitors starting next year, in order to enhance the performance of its in-house 2.5D packaging technology, “EMIB.” The most clearly visible source of demand is Google. Google plans to launch its next-generation AI accelerator, “v8e,” in the second half of next year, and has adopted an EMIB substrate with embedded silicon capacitors for that chip. With other Big Tech companies such as Amazon also currently applying EMIB, analysts say demand could increase sharply. According to industry sources on the 27th, Intel plans to apply silicon capacitors to its 2.5D packaging starting next year. Intel Adopts “Silicon Capacitors” for 2.5D Packaging… Google AI Chip Gets First Application 2.5D is an advanced packaging technology that inserts a thin-film interposer between the semiconductor and the substrate. Because it can connect circuits at higher density compared with conventional packaging that uses only a substrate, demand is rising in the AI and HPC fields. To improve cost efficiency in 2.5D packaging, Intel devised its own technology called EMIB. Rather than using a broad, spread-out interposer, EMIB connects chip to chip using a small silicon bridge. Since bridges only need to be placed where chip-to-chip connections are required, chips can be arranged more flexibly and efficiently. Recently, EMIB has been drawing attention as an alternative to TSMC, which had been leading the existing 2.5D packaging market. This is because TSMC’s 2.5D packaging capacity is suffering from a supply shortage amid the rapid development of the AI industry. Indeed, global Big Tech player Google is also paying attention to EMIB. Google has decided to adopt EMIB for its in-house AI semiconductor “v8e,” which it plans to launch in the second half of next year. Under this structure, TSMC handles chip mass production, MediaTek handles design and manufacturing support, and Intel handles packaging. However, there have been concerns that EMIB is gradually showing limitations in providing stable power supply for AI semiconductors, which consume large amounts of power. Accordingly, Intel plans to introduce new technologies such as silicon capacitors and through-silicon vias (TSV) to ensure stable packaging for the v8e. A capacitor is a component that stores and releases electricity in an electronic circuit. In the case of silicon capacitors, their resistance (ESL/ESR) is more than 100 times lower than that of conventional multilayer ceramic capacitors (MLCC), minimizing the signal loss that occurs in high-performance semiconductors. They can also be designed in an ultra-thin structure based on a silicon wafer, enabling high-density integration. A semiconductor industry official explained, “Because the voltage drop (the phenomenon of voltage decreasing) that occurs in the high-frequency region within AI chips is difficult to solve with MLCC, we understand that Intel is adopting silicon capacitors as a solution,” adding, “The relevant supply chain is now in place, and mass production is set to begin in earnest next year.” EMIB-T Is Already on a Growth Trajectory — The Related Ecosystem and Market Are Expanding Together Intel has also inserted TSVs, which serve as power-delivery channels, into the silicon bridge. The key point is that by using TSVs to shorten the power-delivery path between the substrate and the chip, Intel has improved power efficiency and signal integrity. Intel calls this “EMIB-T.” The industry expects the EMIB-T and silicon capacitor markets to grow rapidly. This is because Japan’s Ibiden — one of the major companies that mass-produces semiconductor substrates for EMIB-T — is aggressively pursuing capital investment. Previously, Ibiden had planned to build its Kawashima (Gama) plant in Gifu Prefecture as a substrate plant for Intel CPUs. However, it postponed that schedule and decided in the first half of this year to officially convert the Gama plant into a mass-production line for EMIB-T substrates. The investment is 220 billion yen (about KRW 2.1 trillion). In its recent earnings announcement, Ibiden stated, “Operation of the Gama plant will begin in 2027 and enter full-scale mass production in 2028,” adding, “EMIB-T substrate capacity is currently far short of demand. However, adding further capacity is quite difficult, so we are discussing options with our customers.” A semiconductor industry official explained, “Ibiden’s EMIB-T-dedicated line is being built with most of the investment coming from customers such as Google, Amazon, and Intel,” adding, “This demonstrates that AI semiconductors based on EMIB-T will grow significantly going forward, and silicon capacitors are likely to expand alongside them.”

🔊 ‘SpaceX is only going to play a more important role in the US military.’ Listen to @DavidJeans2 on the Reuters World News podcast on how SpaceX strong-armed the US military into paying five times more for its Starlink connections

Everyone chases the loudest yield. The safest one might be the one paying 12%+ on stables. fxSAVE LP on @pendle_fi is now paying over 12% APY. No leverage loop. No points meta. Just a clean Pendle yield market for people who want to park stables and get paid.

#STEPN# & #STEPNGO# May Townhall Recap 📝 🔹 Last two months retrospective 🔹 Challenge Capsules 🔹 STEPNathon 2 Missed it? We got you covered 👇 🔄 Last two months retrospective The Townhall opened with a look back at some of the main updates from the last two months: 🔸 Rabbids 🔸 Marathon Season 2 🔸 LSD for Legendary holders 🔸 Android Marketplace removal On the Android side, the team acknowledged that the Marketplace had to be removed due to Google Play restrictions. 🐰 Rabbids The Rabbids event leaned fully into community participation, with users posting April Fools content, memes, fake breaking news, and all kinds of chaotic entries to earn Rabbids GGBoxes. Those GGBoxes included chances to win 100 Rabbids co-branded Solana Genesis Sneakers, along with rewards like 100k GMT, 1k USDT, and $50 worth of XAUT. And importantly, there are still some Rabbids Genesis Sneakers left to be found in GGBoxes. 🏁 Marathon Season 2 The Townhall also looked back at Marathon Season 2, with a strong focus on how Teams have changed the tone of the challenge. A few highlights: 🔹 Players are not only competing for themselves, but also for their team 🔹 Teams have made the Marathon more collaborative, more competitive, and more social 🔹 Team Takeover was introduced during Round 4 🔹 The top 3 teams and 4 random active teams could earn additional rewards The team also confirmed that work on Season 3 is already in progress, and community feedback is welcome through Discord and the ambassador team. 🐈‍⬛ LSD Legendary Schadenfreude Day was another highlight of the last two months. The event gave Legendary holders with unlucky or disappointing stats a chance to share why their Sneakers deserved better. Selected entries had a chance to receive improved stats, although usually with a trade-off involved. The result was a playful event with a strong identity, while also creating a fun way to engage directly with Legendary holders. 🎟️ Challenge Capsules Challenge Capsules were the main product topic of this Townhall. The team clarified that while some users expected Charm in STEPN GO to eventually connect to avatar pieces or characters, that direction is no longer being pursued, even if that expectation came from how Charm was described in the STEPN GO whitepaper. The reason is simple: 🔸 It was not fun enough 🔸 It was also technically difficult to deliver at the level the team wanted So instead, Charm is being redirected into a new feature that adds more gamification to both apps. Challenge Capsule is a game mode built around movement, task completion, reward opportunities, and discovery. The core loop is simple: 🔹 Open a Capsule 🔹 Reveal the challenge 🔹 Complete it 🔹 Earn a Ticket 🔹 Join the draw for a prize A few key points: 🔸 Challenge Capsules will work with both STEPN and STEPN GO through FSL ID 🔸 Users enter a Capsule by paying an entry fee 🔸 Each Capsule has its own challenge, conditions, and reward pool 🔸 Users need to complete the required challenge within the given time limit 🔸 Completing the challenge successfully gives the user a Ticket for the reward draw And importantly, this is not passive participation. Users need to move, complete the challenge, and earn their chance. For STEPN GO: 🔹 Charm will now have a clearer role in the system 🔹 Charm runs can help users earn more Tickets and improve their chances at winning the Capsule’s draw For STEPN: 🔹 Resilience becomes the key attribute in the system 🔹 Resilience now gets more utility through Challenge Capsules 🔹 STEPN players will also have a chance to obtain a new type of Mystery Box containing Challenge Capsule Tickets 🔹 Those Tickets give users more chances to win the Capsule reward The feature will go live in limited access beta within the upcoming weeks, with more details to be shared soon. 🏃 STEPNathon 2 The Townhall also included an exclusive first announcement for STEPNathon 2. From June 22 to June 29, players will be able to take on the challenge by completing either 21 km or 42 km in a single session using STEPN and or STEPN GO. To participate: 🔹 A Season Pass is required 🔹 Every finisher automatically enters a Genesis Sneaker raffle 🔹 There will be one raffle for STEPN and one for STEPN GO Event rewards will depend on both the app and the distance completed. In STEPN: 🔸 Players can earn exclusive badges, backgrounds, and GGBoxes In STEPN GO: 🔸 Players can unlock exclusive backgrounds and GGBoxes A few more infos: 🔹 Completing 42 km also unlocks the 21 km reward tier 🔹 Each badge and background is unique to the app and to the distance 🔹 Teams also matter this time The Marathon team with the highest total Energy spent during the event week will receive additional exclusive rewards: 🔸 A unique badge 🔸 A special background 🔸 5 GGBoxes plus 1 Key for each member So STEPNathon 2 keeps the spirit of the original challenge, while connecting more directly to the team dynamics introduced in Marathon Season 2. That’s the May Townhall recap. Challenge Capsules are introducing a new gamified movement layer across STEPN and STEPN GO, STEPNathon 2 is coming back, and the last two months have continued to push both products toward a more social and more interactive direction.

Could private credit stress cause a liquidity crisis? Federated Hermes' Deborah Cunningham explains why that's unlikely - and why some indirect risks are still worth paying attention to