与「DSP라디오」相关的搜索结果

#dspradio# @KARA_DSP Part2 #하라에게답을구하라# TW @KARA_DSP 를 통해 #하라# 에게 궁금한 점을 질문하세요 :) 12월16일 ~ 12월17일(수) PM 17:00까지 #DSP라디오#

Our new album in full Spanish #DiosBendiga# is out now on all DSP’s ‼️ Make sure to order your Vinyl / CD 💿 Comment your favorite song below ⬇️⬇️⬇️ #CypressHill# ☠️

कांग्रेस के इशारों पर पुलिसिया दमन और पत्थरबाज़ी लोकतंत्र पर हमला है। भाजपा कार्यकर्ताओं पर चुन-चुनकर लाठीचार्ज करने वाले संबंधित DSP पर तत्काल कार्रवाई कर उन्हें बर्खास्त किया जाए। पुलिस का काम कानून का पालन कराना है, किसी राजनीतिक दल का टूल बनना नहीं। इस हमले में भाजपा कार्यकर्ताओं, वरिष्ठ नेताओं और पत्रकारों तक को गंभीर चोटें आईं। कांग्रेस समर्थित पत्थरबाज़ों की पहचान कर उन पर कड़ी कानूनी कार्रवाई हो, ताकि भविष्य में लोकतांत्रिक आंदोलनों को हिंसा से कुचलने की कोशिश न हो। : श्री @AdityaPdSahu जी, प्रदेश अध्यक्ष

Light up your voice with the Razer Seiren V3 Chroma 32-Bit DSP: Stream-reactive Razer Chroma RGB transforms your setup by enhancing your stream with immersive, dynamic lighting. Combined with a 32-Bit DSP and AI-powered Smart Audio that adapts to your space for consistently clean vocals, you can focus on entertaining your audience while your setup does the rest.

还韩国国运不？还存储超级周期不？还那女孩对我说不？还最好的夏天不？还黄金时代不？还退学 All in AI 不？还 800G 不？还 1.6T 不？还 CPO 不？还 NPO 不？还 ABF 载板不？还玻璃基板不？还陶瓷基板不？还先进封装不？还算力租赁不？还光模块不？还 EML 芯片不？还 DSP 芯片不？还薄膜铌酸锂不？还保偏光纤不？还 CW 光源不？还 PCB 药水不？还铜粉不？还球形硅微粉不？还 MLCC 不？还电子布不？还一代布二代布不？还 MSAP 不？还 AI 革命不？还 token 摩尔定律不？还半导体国产替代不？还改变世界不？还装逼不？

chips get all the love but the interconnects across all levels from c2c to rack-to-rack are as important, and many chip makers are sleeping on it until very recently. Even most interconnects people just want it to be as transparent as possible, just send and receive the bits with lower error rates and lower energy per bit, wrong long-term direction imo. Interconnects are part of the living creature, so many things happening in your blood vessels in addition to just moving stuff, and your axons do much more than carrying spikes. People do not appreciate interconnects, smaller volume, poor margin, messy ecosystem, manual process, it's been a spiral of grinding, and it is largely invisible. How often do you see people tearing down transceivers and die shot of DSP chips vs logic chips? How often do you see high res pictures of all the connector's gold fingers on the NVL72 cartridge? Because it sounds boring, it's just making contacts, shoving electrons and photons, what a simple problem. But that is deceiving, and theres so much to it. You might want 576 to begin with, had to cut down to 288, then to 144, and finally to 72, and that barely worked first time. You are entering the domain of analog and mixed signaling, you are fighting copper real estate with power delivery, you are getting impedance mismatch and reflections and interference at every stupid interfaces, your optical components' and connectors' backreflection is making your laser mode hop.. And we are not even going into the thermal and strain-stress, the reliability of how many times you can actually mate your connector, the horrible jobs people are doing across the stack from science-project-originated photonic PDKs to hand cleaved laser dies to optical engines to rack manufacturing, on spec-ing out the requirements, the tolerances.. On top of all these, people thinking about where the bits should be going and people who know what the bits have to go thru are two totally different groups of people. But it is shifting, pluggable volumes shipped are doubling and tripling for scale-out, scale-up domain asks for much higher bw than scale-out, and interconnects are inevitable even if you cram as much compute and memory onto a single wafer. People will see it always has been interconnects, the chips people have already been doing it on the chips, that you can sort it out with your chip designers and foundries, and now you need to work with more people to sort it out from chips to boards/trays to racks to pods to data halls and data centers. These people speak very different languages and care about very different things, and it will take a lot of effort to pull order out of all the chaos. At the end of the day, it is such a crazy problem to work on, such a beautiful thing to make, millions of amps of current flipping 1e20 of flops, sextillions of photons carrying thousands of terabits per second, a few tons of copper, tens of thousands of fibers totally few hundred kilometers, one scale-up domain. You absolutely need a group of people that appreciate the beauty and care about the craft behind the grinding to make it together.

怎么我一买进美股就跌了 我成本337的MRVL 要哭了 刷到白毛股神（Serenity）的开源 Serenity skill，正好在GitHub上， 感觉可以站在前辈的视野去分析一下MRVL，就直接丢进我目前在用的EasyClaw AI给我整了个挺详细的报告，按白毛股神那套“找最难扩产瓶颈”的思路拆了一遍， 我挑重点说说： MRVL卡在哪： 它同时卡住了AI数据中心两个硬活：定制AI加速芯片（ASIC） + 光互联（DSP、CPO、硅光）。 客户认证周期长、切换成本高，不是随便谁都能挤进来的。 Amazon Trainium、Google Axion都有它份，Celestial AI和XConn的收购又把光互联护城河加厚了。 业绩看： 今年营收一路超预期，FY27目标接近110亿刀，订单能见度强，每季度guidance都在往上调。数据中心业务占75%左右，增长很猛。但高位接盘的现实： 股价现在大概在280-308区间（我接的时候接近高点），估值不便宜（forward PE 70-90x），已经price in很多好消息。微软那边有传闻可能部分转给Broadcom，这是最大风险点。AI给的操作建议（挺实在，没画大饼）：如果你还信AI互连和定制ASIC是真瓶颈，就别全卖，留核心仓位。 但也别死扛：反弹一点先减20-30%，止损位设好。 想加仓等明显回踩 + 新催化（比如Google新chip官宣、CPO量产进展、Q2财报微软收入没大掉）。 整体仓位别太重，分散风险。 风险（AI直说）： 微软ASIC流失可能是真雷；毛利率还在下滑；高估值没缓冲； AI资本开支如果边际放缓就危险。 看完以后心情好多了，至少知道自己在干嘛 白毛股神这套卡点思维还是蛮适合普通人的，每次想要买或者不懂的时候， 可以跟这个skill对话一下了解具体情况 让自己不至于那么心慌 工具链接扔评论区了 👇

我把AI未来3年的核心瓶颈排了个序，大概是这样： 1. 存储（HBM + DRAM + eSSD，已经涨价、签长单、利润兑现） 2. 光互连（800G / 1.6T + Scale-Up + Scale-Across，连接接棒算力） 3. 先进封装（CoWoS + CoPoS + HBM封装，HBM和GPU放量的前提） 4. ASIC + Networking（自研芯片、交换芯片、SerDes、DSP，MRVL/AVGO核心位置） 5. 电力 / AI Factory（变压器、电网、UPS、800V DC、BBU，并网容量是真瓶颈） 6. 液冷（DLC、CDU、冷板，高功率机柜必选项） 7. 核能 / 发电（长期空间巨大，但兑现节奏慢于电力设备） 8. PCB / ABF / CCL（AI服务器和先进封装配套材料，真实受益但控制力弱于前面） 9. MLCC / 被动元件（高频高压高功率带来用量提升，属于配套瓶颈） 10. 半导体设备（检测、量测、测试、先进封装设备，卖水给淘金者） 11. Physical AI（机器人、自动驾驶、工业AI，空间大但2026仍偏预期） 12. Agent / 数据层（方向确定，但赢家和利润分配还不清晰） 13. 稳定币 / AI金融（AI Agent支付层，空间大但商业化还早） 未来三年市场会越来越关注：谁是真瓶颈，谁能把瓶颈兑现成利润，谁控制下一代架构。 我目前最看好的，还是存储第一，光互连第二，先进封装第三。因为AI发展到最后，拼的是谁真正卡住了整个产业链的命脉。

老黄带货光模块 mrvl ，我看了下，美股光模块还有： AVGO：AI ASIC、网络交换、CPO/硅光方向的基础设施核心，但估值和共识都高。 MRVL：定制 ASIC、DSP/光互联相关；受 AI capex 节奏影响大。 COHR：光模块、激光器和材料链关键供应商；更接近物理瓶颈。 LITE：EML/激光和高速光器件；看 800G/1.6T 转化。 CRDO：AEC/高速互连和 SerDes 受益，弹性高但估值波动大。

今天分享一套光通信生态股票 首先说明，这几只股票昨天在社区已经跟伙伴们一起讨论过了 美股光通信生态 材料层 $GLW：主导光纤预制棒与电缆，近垄断地位 $AXTI：InP衬底主要供应商 光芯片/激光器层 $LITE 和 $COHR ：掌控激光器（EML、VCSEL、窄线宽激光）、InP衬底、PIC等，垂直整合形成最深护城河 DSP/ASIC层 $AVGO：主导PAM4 DSP与平台级解决方案 模块/集成层 $AAOI：负责800G/1.6T transceiver集成，向CPO延伸 系统层 $CIEN：提供光传输设备 光通信这个叙事，因为AI的发展，已经越来越重要，同时高端激光器，光前材料、先进封装，这些都是刚需。 综合看这几家公司的财报，LITE增长最爆炸，GLW最稳健，COHR均衡，AAOI弹性最高，AVGO提供平台稳定性 下一季度的财报集中在7-8月份 因为情绪的支撑，这几家股价都出现了大幅上涨，并且在昨天收盘时，已经出现了小幅的回调 但，长期肯定是看多 这是一整套光通信的股票 核心可以布局LITE（附加：AXTI）、COHR、GLW、AVGO 附加AAOI、CIEN 这样就形成了闭环 PS：附加股，波动较大 DYOR #美股# #光通信# #AI#