2028 后限制 AI 算力硬件的不再是晶体管,而是封装!是怎么把多颗 die 封进一个 240mm 巨块并喂进 4kW 的电,然后再把热和光导给出去⚡️配图来自日本 3DIC Research Lab 「先进封装技术研讨会」我转译成了中文,中间那块剖面图,是一个超大尺寸的 3D 异构集成封装,当然这个路线图略显激进😜
- Co-Package Optics(FAU / EIC / PIC, 2λ/4λ):光直接进封装,铜互连到头 → 这是 CPO 从"会发生"被画成 2028 默认路线的又一独立信源;
- >4kW Cooling, Direct-to-Chip → Direct-to-Silicon, 直接液冷:单封装功耗破 4 千瓦,液冷从"贴芯片"进化到"贴硅";
- Vertical Power Delivery, High-voltage DC, PMIC / IVR / DTC:供电从机柜压进封装内部,垂直供电 + 高压直流 + 就近稳压 → 电已经压到封装级,催生封装内供电器件;
- D2D / UCIe / micro-bump 3D / Cu direct 3D:chiplet 标准化互连、铜直连 3D 堆叠;
- >10 reticle Interposer(Panel-level)/ 240×240mm² Substrate:中介层超 10 个光罩、改用面板级工艺,超大多层基板 → 封装设备/材料(日韩台供应链),基板成新瓶颈;
这么大封装最易翘曲,良率/可靠性是隐性门槛。但传统基板已撑不住 >200×200mm² 的 mega-size 封装,需要全新 building block!
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I think something to highlight also is not all my ideas are green, especially on short term timeframes!
My core three themes are Neoclouds (Energy), Memory, and Photonics.
And I'm glad I chose the literal top performers for each segment from $NBIS to $EWY leaps to $SIVE.
However, I still have pretty large losses following the false analyst report on CPO delays that $NVDA refuted:
That nuked 3 of my TW CPO longs from Foci, Msscorp, Xintec and others. (which are heavily red). Shunsin / Win Semi are holding up much better though.
Some of the other ones in Japan that I've mentioned like Towa, Harmonic Drive, NCI, etc. are performing much better following short-term volatility.
As for Korea yes I have PTSD for from Auros and now Foosung that are both both red (I didn't own 093370 though, just got PTSD watching price action).
Idk if I'll touch Korea again, just way too volatile. But I still think those will end up green eventually following Sk hynix/samsung qualifications + HVM, and the future japanese supply chain shutdown.
I also did change some of my previous long ideas like $XLU following the Iran War nuking all chances of rate cuts from 3-4 down to 0, and that didn't play out too well. Three software names I mentioned previously like $TTD, $META ended up red. $SNAP, I also changed my thesis after noticing the endless SBC accounting methods. $RDDT idea was finally in the green from $130 -> $170 after a long time.
But I think the vast majority of my ideas like $MRVL, $NBIS, $ARM, $INTC, $MU, $LITE, SK Hynix, Samsung, for larger cap.
Down to $AXTI, $LITE, $AAOI, $RPI, $IQE, and others for smaller cap positions directionally play out pretty well.
With random stuff like $SIMO, $HPS.A, $TSEM, $AEHR, $LPK, $SOI, $ALRIB, and so on all ended up turning out aight too.
The blended average is kinda overwhelmingly green since majority of my long ideas are triple digit YTD.
But I've definitely missed a few.
Also entry point is really important too... I mentioned $AAOI at $30 or $AXTI at ~$13, but not everyone has the same entry point. So if someone bought AOI at $220 and it dropped to $160, I'd feel bad.
But regardless, I'd prefer to judge how ideas play out on medium term timeframes over a few months rather than a few weeks.
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New reports that $AMD is scrambling for CW laser supply.
And is negotiating large-scale purchase orders for CW Lasers to ensure its production capacity is not constrained by $NVDA (Trendforce)
Obvious CW laser beneficiaries:
- $SIVE (AMD went to GFS for CPO, Sivers reference laser level)
- $AAOI (Rosenblatt analyst checks)
Lumentum/Coherent are kinda booked out way into 2028 as well.
Lumentum is especially constrained for CW capacity already from existing EML contracts (so they probably are buying from Sumitomo/Furukawa and co).
Maybe Macom and Japanese giants still have spare capacity. (disclosure, own aaoi/sivers).
I predicted this last year and said hyperscalers should go more upstream to secure capacity... at laser levels, epiwafer levels, or even inp substrate levels.
To not get bottlenecked by Nvidia.
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